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Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

    Buy cheap Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver from wholesalers
     
    Buy cheap Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver from wholesalers
    • Buy cheap Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver from wholesalers
    • Buy cheap Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver from wholesalers
    • Buy cheap Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver from wholesalers

    Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

    Ask Lasest Price
    Brand Name : OEM and ODM
    Model Number : SL80815S002
    Certification : UL,RoHS, CE
    Price : Negotiable
    Payment Terms : T/T, Western Union, MoneyGram,Paypal
    Supply Ability : 1000pcs per day
    Delivery Time : 5-7 days
    • Product Details
    • Company Profile

    Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

    Thick copper 4OZ FR4 printed circuit board Prototype Immersion Tin / Silver


    4OZ FR4 PCB Specifications


    Thick copper printed circuit board
    a). Impressive Quality
    b). Fast Lead Time
    c). Good Service


    Thick copper printed circuit board

    Process Capability



    ltem

    Mass Production

    Prototype


    Surface Treatment

    HASL(LF)

    HASL(LF)

    Immersion Gold

    Immersion Gold

    Flash Gold

    Flash Gold

    OSP

    OSP

    Immersion Tin

    Immersion Tin

    Immersion Silver

    Immersion Silver

    HASL&Gold Finger

    HASL&Gold Finger

    selective nickel

    selective nickel

    HASL(LF)

    smt Pad:>3um

    smt Pad:>4um

    Big Cu:>lum

    Big Cu:>l.5um

    Immersion Tin

    0.4-0.8um

    0.8-1.2um

    Immersion Gold

    Ni:2-5urn

    Ni:3-6urn

    Au:0.05-0.10um

    Au:0.075-0.15um

    Immersion Silver

    0.2-0.6um

    0.3-0.6um

    OSP

    0.1-0.4um

    0.25-0.4um

    Flash Gold

    Ni:3-6urn

    Ni:3-6urn

    Au:0.01-0.05um

    Au:0.02-0.075um

    Laminates

    CEM-3,PTFE

    CEM-3,PTFE

    FR4 (HighTG etc)

    FR4(HighTG etc)

    Metal Base(AL,CUetc)

    Metal Base(AL,CUetc)

    Rogors,etc

    Rogors,etc

    MAX.Layers

    12(Layers)

    40(Layers)

    MAX.Board Size

    20"X48"

    20"X48"

    Board Thickness

    O.4mm~6.0mm

    <O.4mm or >8.0mm

    Max.Copper Thickness

    inner Layer:16oz

    inner Layer:16oz

    Outer Layer:16oz

    Outer Layer:16oz

    Min.Track Width

    3mil/0.075mm

    3mil/0.075mm

    Min.Track Space

    3mil/0.075mm

    3mil/0.075mm

    M.in Hole Size

    8mil/0.2mm

    6mil/0.1mm

    M.in Laser Hole Size

    4mil/0.1mm

    3mil/0.076mm

    PTH Wall Thickness

    0.8mil/20um

    1.2mil/30um

    PTH Dia.Tolerance

    ±2mil/±50um

    ±2mil/±50um

    Aspect Ratio

    12:1

    15:1

    lmpedance Control

    ±5%

    ±5%


    PCBA Technology Capability


    · Smallest chip placement:0201

    · Automated axial insertion and Automated radial insertion

    · Computer controlled Pb free wave soldering system

    · High speed Pb free surface mount production lines

    · Providing electronic components purchase service for the customers

    · ICT on line inspection, PCBA function test equipment, Visual inspection


    Mould And Box build Service


    · Box Build

    · Plastic injection

    · Finish Packaging


    PCB Picture


    Quality Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver for sale
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