Four Layers PCB Circuit Board , Automobile Flexible Printable Circuit Boards 15/10GL7=TET111-08-20-30

Total Pad Size

Standard

Advanced

Capture Pad

Drill + 0.008

Drill + 0.006

Landing Pad

Drill + 0.008

Drill + 0.006

BC Mechanical Drill (Type III)

0.008

0.006

Laser Drill Size

0.004-0.010

0.0025

Material Thickness

0.0035

0.0025

Stacked Via

Yes

Yes

Type I Capabilities single & Double Deep

Yes

Yes

Type II Capabilities Buried Vias with Microvias

Yes

Yes

Type III Capabilities

Yes

Yes

Copper Filled Microvia

Yes

Yes

Smallest Copper Filled Microvia

0.004

0.0025

Copper Filled Microvia Aspect Ratio

0.75:1

1:01

Smallest Laser Microvia Hole Size

0.004

0.0025

Laser Via Aspect Ratio (Depth:Diameter)

0.75:1

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Scheduled deliveries

Engineering prototypes

Lead-free/RoHS compliant

Low cost first article builds

No-clean process available

Parts Procurement

Selected Stencils

Selected Ball Grid Arrays (BGA)

Turnkey

Laser cut stainless steel

As small as .5mm pitch

Kitted/Consigned

Nano-coating available

All BGA placements are x-ray inspected

Partial Turnkey

Assembly Types

Selected Component Types

Selected Other Capabilities

Surface Mount (SMT)

As small as 0402 package

Pitch components as small as 15 mil

Thru-hole

As small as 0201 with design review

Repair/Rework services

Mixed Technology (SMT/Thru-hole)

Mechanical Assembly

Single or double sided placement

Box Build/Electromechanical Assembly

Sub-assemblies