TO277 Series Schottky Diode SP1045L SMD Miniature Transient Voltage
Suppressor Diode
Features
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
Mechanical Data
Case:JEDEC TO-277B molded plastic body
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Mounting Position: Any
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified,
Resistive or Inductive load, 60 Hz. For Capacitive load derate
current by 20%.
| SYMBOLS | SP1040L | SP1045L | SP1050L | SP1060L | SP10100L | unit |
| Maximum repetitive peak reverse voltage | VRRM | 40 | 45 | 50 | 60 | 100 | V |
| Maximum RMS bridge input voltage | VRMS | 28 | 32 | 35 | 41 | 70 | V |
| Maximum DC blocking voltage | VDC | 40 | 45 | 50 | 60 | 100 | V |
Maximum average forward rectified current at TL=110 C | I(AV) | 10 | A |
| Peak forward surge current 8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) | IFSM | 175 | A |
Maximum instantaneous forward T A =25 C voltage at 10.0A TA=100 C | IR | 0.45 0.42 | 0.55 0.48 | 0.68 0.56 | uA |
Maximum DC reverse curren T A =25 C at rated DC blocking voltage TA=100 C | CJ | 0.5
| pF |
| Typical thermal resistance (NOTE 1) | RqJA | 31 | ℃/W |
| Operating junction and storage temperature range | TJ,TSTG | -55 to + 150 | ℃ |
Note:1.Polymide PCB ,2oz.Copper Cathode pad dimensions
18.8mmx14.4mm.Anod pad dimensions 5.6mmx14.4mm
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