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PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing

    Buy cheap PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing from wholesalers
     
    Buy cheap PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing from wholesalers
    • Buy cheap PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing from wholesalers
    • Buy cheap PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing from wholesalers
    • Buy cheap PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing from wholesalers

    PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing

    Ask Lasest Price
    Brand Name : HUASWIN
    Model Number : HSPCBA1016
    Certification : ISO/UL/RoHS
    Price : Negotiation
    Payment Terms : T/T, Western Union, L/C
    Supply Ability : 10,000pcs per month
    Delivery Time : 15-20 working days
    • Product Details
    • Company Profile

    PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing

    Chip On Board Assembly PCB CEM-3 Material Multilayer Lead Free HASLSurface Finishing Green Sold Mask White Silkscreen


    FAQ


    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, PNP and Components Position

    Q:Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: How can I know the process of my PCB production?
    A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.


    Detailed Specification of PCB Manufacturing

    1layer1-30 layer
    2MaterialCEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,
    Aluminum-based material.
    3Board thickness0.2mm-6mm
    4Max.finished board size800*508mm
    5Min.drilled hole size0.25mm
    6min.line width0.075mm(3mil)
    7min.line spacing0.075mm(3mil)
    8Surface finishHAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold,
    OSP
    9Copper thickness0.5-4.0oz
    10Solder mask colorgreen/black/white/red/blue/yellow
    11Inner packingVacuum packing,Plastic bag
    12Outer packingstandard carton packing
    13Hole tolerancePTH:±0.076,NTPH:±0.05
    14CertificateUL,ISO9001,ISO14001,ROHS,TS16949
    15Profiling punchingRouting,V-CUT,Beveling



    Detailed Specification of Pcb Assembly

    1Type of AssemblySMT and Thru-hole
    2Solder TypeWater Soluble Solder Paste,Leaded and Lead-Free
    3ComponentsPassives Down to 0201 Size
    BGA and VFBGA
    Leadless Chip Carries/CSP
    Double-Sided SMT Assembly
    Fine Pitch to 08 Mils
    BGA Repair and Reball
    Part Removal and Replacement-Same Day Service
    3Bare Board SizeSmallest:0.25x0.25 Inches
    Largest:20x20 Inches
    4File FormatsBill of Materials
    Gerber Files
    Pick-N-Place File(XYRS)
    5Type of ServiceTurn-Key,Partial Turn-Key or Consignment
    6Component PackagingCut Tape
    Tube
    Reels
    Loose Parts
    7Turn Time15 to 20 days
    8TestingAOI inspection
    X-Ray inspection
    In-Circuit testing
    Functional test


    PCB capability and services:


    1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
    2. Flexible PCB (up to 10 layers)
    3. Rigid-flex PCB (up to 8 layers)
    4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
    5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
    6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
    7. Quantities range from prototype to volume production.
    8. 100% E-Test







    Chip On Board Assembly Quality Processes:


    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection (FAI) for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949


    Testing:


    AOI (Automatic optical inspection)
    ICT(In-circuit test)
    Reliability test
    X-Ray Test
    Analogue and digital function test
    Firmware programming


    Product Tags:

    COB Assembly

      

    circuit board assembler

      
    Quality PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing for sale
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