MIC24313-0101-LF3 RJ45 Modular Connectors LPJ1014BHNL With
Integrated Magnetics
- 1X1 Tab-Up RJ45 LPJ1014BHNL 10/100Mbps Ethernet
- RJ45 Integrated Magnetics Connector MIC24313-0101-LF3
- Cross Equivalent MIC24313-0101-LF3 Pin to Pin Replace
Cost-Effective
- Designed for industrial rated applications , Meets IEEE802.3
specification
- 350μH minimum OCL with 8mA DC bias current
- Extended Temperature range from 0℃ TO 70℃
| Emitting Color | λp(nm) | VF@IF=20mA | IR @VR=5V |
| Green | 565 | 1.8~2.6V | 10μA max |
| Yellow | 585 | 1.8~2.6V | 10μA max |
NOTES:
1.Designed to support application,such as SOHO(ADSLmodems),LAN-on-
Motherboard(LOM),hub and Switches.
2.Meets IEEE 802.3 specification
3.Connector Materials:
Housing: Thermoplastic PBT+30%G.F UL94V-0
Contact: Phosphor Bonze C5210R-EH Thickness=0.35mm
Pins: Brass C2680R-H Thickness=0.35mm
Shield: SUS 201-1/2H Thickness=0.2mm
Contact plating: Gold 6 micro-inches min.In contact area.
4.Wave solder tip temperature: 265℃ Max, 5 Sec Max
5.UL Certification: File Number E484635
| LINK-PP Part Number | LPJ1014BHNL |
| Designing Model | MIC24313-0101-LF3 |
| Cores per Port | 4 |
| LED Option | GREEN/YELLOW |
| Latch | TAB UP |
| Number of Ports | 1X1 |
| PCB Mount Angle | SIDE ENTRY |
| Package Height (mm) | 13.45 |
| Package Length (mm) | 25.25 |
| Package Width (mm) | 16.15 |
| Shield EMI Tabs | WITH |
| Speed | 10/100 BASE-T |
| Temperature | 0 TO 70℃ |
| Turns Ratio RX | 1CT:1CT |
| Turns Ratio TX | 1CT:1CT |
Applications For Terminal User
Designed to support applications, such as ADSL modems,
LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card,
Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways
setup,Border Gateway Protocol,fast ethernet switch ...
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics
,Cypress, Freescale,EKF.......
EMS Application
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
