PCB depaneling (singulation) laser machines and systems have been
gaining popularity over recent years. Mechanical
depanaling/singulation is done with routing, die cutting, and
dicing saw methods. However, as the boards get smaller, thinner,
flexible, and more sophisticated, those methods produce even more
exaggerated mechanical stress to the parts. Large boards with heavy
substrates absorb these stresses better, while these methods used
on ever-shrinking and complex boards can result in breakage. This
brings lower throughput, along with the added costs of tooling and
waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and
they also present challenges to the old methods. Delicate systems
reside on these boards and non-laser methods struggle to cut them
without damaging the sensitive circuitry. A non-contact depaneling
method is required and lasers provide a highly precise way of
singulation without any risk of harming them, regardless of substrate.
Simi Automatic UV Laser Cutting Machine for Pcb Depaneling
Machine,SMTfly-5S Features:
High precision CCD automatic positioning, automatic focusing;
Fast and accurate positioning, save time and no worries;
Friendly interface,Simple operation, easy to use, free application;
Small size, Save more space;
rigorous security design;
Reduce energy consumption;
Cost savings;
Cost-effective, fast cutting speed,stable performance.
Advantages of Laser PCB Depaneling/Singulation Machine:
- No mechanical stress on substrates or circuits
- No tooling cost or consumables.
- Versatility – ability to change applications by simply changing
settings
- Fiducial Recognition – more precise and clean cut
- Optical Recognition before PCB depaneling/singulation process
begins.
- Ability to depanel virtually any substrate. (Rogers, FR4, ChemA,
Teflon, ceramics, aluminum, brass, copper, etc)
- Extraordinary cut quality holding tolerances as small as < 50
microns.
- No design limitation – ability to cut virtually and size PCB board
including complex contours and multidimensional boards
UV Laser PCB Depaneling System-Laser Cutting MachineSpecification:
| Technical Parameter | Main body of laser | 1480*1360*1412 |
| Weight | 1500KG |
| Laser | 355nm |
| Laser | Optoware 10W (US) |
| Material | ≤1.2mm |
| Precision | ±20μm |
| Platform | ±2μm |
| Working Area | 600*450mm |
| Maximum | 3KW |
| Vibrating | CTI(US) |
| Power | AC220V |
| Diameter | 20±5μm |
| Ambient | 20±2℃ |
| Ambient | < 60% |
| The Machine | Marble |
Application for Laser PCB Depaneling Machine:
- FPC and some relative materials;
- FPC/PCB/ Rigid‐Flex PCB cutting,
- Camera module cutting.
FPC Laser Cutting/ Depaneling-Laser PCB Depaneling Machine with CE:
Our Service:
1. We supply a wide range of products and provide one-stop service
for Electronic Assembly Industry.
2. We can also customize the products to fulfill different
requirements.
3. We are a leading manufacturer of ESD Products, Cleanroom
Products, Tools & Instruments for
Electronic Assembly Industry.
4. We keep a lot of stock for regular products and we can support
small orders. Usually, our lead time
is just 3 days.
5. Credibility: We are the 6th year Alibaba Gold Supplier. Our
customers are located all over the world.
6. Gratitude: We cherish and feel grateful to every customer for
the business you give us. We are
your reliable partner and will return to you with good products and
good support.
7. Professional: We have been in this business for more than 10
years. We have a strong professional
team with various experiences.
8. We keep doing new product development. Our goal is to enhance
our competitive capacity constantly.
9. Promise: we are always ready to shoulder the responsibility if
any loss caused to our customer due
to our mistakes
10. Price: we always offer competitive prices and help our
customers to cost down.
11. Quality: we do 100% inspection before the shipment.
Contact Information Contact.pdf
