3D SPI-Advanced 3D Solder Paste Inspection System SPI,SMTfly-V700 Specification:
| Mechanical System | PCB Transfer System | Substrate fixing method: bottom-up fixing; automatic access plate
and automatic width adjustment system, conforming to SMEMA
standard; track height: 900±20mm |
| PCB size | 25mm*60mm~250mm*300mm (Customized) |
| PCB thickness | 0.3mm~3mm |
| Plate bending compensation | <1mm |
| X, Y Platform | Drive Equipment |
AC Servo Motor System |
| Positioning accuracy | <1μm |
| Travel speed | 700mm/s |
| Control System | Computer Host | Industrial Control Computer: Intel High-end quad-core CPU, 8GDDR
memory, 1T hard disk |
| Display output | 19-inch widescreen LCD monitor |
| Other parameters | Mechanical dimensions (length * width * height) | 82cm*65cm*76cm |
| Weight | 75 kg |
| Power | AC220V±10%, 50/60Hz, 450W |
| Air source | 4-6bar |
| Working environment Temperature | 10-40°C, Humidity 30-80%RH |
3D SPI-Advanced 3D Solder Paste Inspection System SPI,SMTfly-V700
Features:
Red glue detection
This device, in addition to supporting common 3D solder paste
inspection, can also detect red rubber process at the same time,
supporting missed printing, overflowing plastics, multiple
adhesives, and low adhesives, etc., and displaying full-color
defective image. Positioning.
Bare-board learning programming
No Gerber and CAD files are required, as long as a bare board is
provided, automatic learning programming can be realized. The
software automatically extracts the detection frame data, and the
user edits it appropriately, and sets detection parameters and
allowable values.
Automatic plate bend compensation
The three-dimensional plate bending compensation technique is used
to perform surface fitting on the discrete reference points in the
FOV to perform real-time compensation during the detection process.
There is no need to move the Z axis and the detection speed is
faster.
Camera bar code recognition
The camera can automatically identify the bar code
(one-dimensional/two-dimensional) of the inspection surface on the
PCB to facilitate trace ability of product quality.
Offline programming and debugging
The remote programming can be done by using offline programming
software to import Gerger, CAD, etc. The programming time does not
exceed 5 minutes.
Detection frame can be adjusted at any time
The size and shape of openings in some gerber files may not be
exactly the same as openings in the stencil. In this case, the data
(position, size, shape, etc.) of the detection frame can be
manually adjusted through the learning mode.
