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High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

    Buy cheap High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP from wholesalers
     
    Buy cheap High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP from wholesalers
    • Buy cheap High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP from wholesalers
    • Buy cheap High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP from wholesalers

    High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

    Ask Lasest Price
    Brand Name : METS
    Price : Negotiable
    Payment Terms : TT,LC
    Supply Ability : 1000000
    Delivery Time : 5-20days
    • Product Details
    • Company Profile

    High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP


    Progressive stamping die for high speed press semiconductor lead frame


    TO,DIP,ZIP,SIP,SOP,SSOP,TSSOP


    Lead frames are the metal structures inside a chip package that carry signals from the die to the outside.

    Leadframe for a QFP package
    The die inside the package is typically glued to the lead frame, and then bond wires attach the die pads to the leads. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and outside of the lead frame is cut-off, separating all leads.


    Progressive die for lead frame:
    -- Discrete device lead frame dies: TO-92,TO-196,ITO-220,TO-252,TO-247,TO-3P etc.
    -- IC lead frame dies:DIP-8L,DIP-16L,DIP-18L,DIP-28L,SOP-8L,SOP-16L,SOP-28L,SSOP-8L,SSOP-18L etc.
    -- SMT lead frame dies: SOT-23,SOT-143 etc.


    A. Material:0.2mm, 0.25mm, 0.3 mm thick brass, copper or stainless steel
    B. Finishing:silver,gold ,palladium,tin ,nickel plated
    C. Size: customized
    D. Packing method: Polybag, carton box


    Stamping Capability

    A: The min. pitch: 0.5mm

    B: Highest stamping speed: 600SPM/min or more

    C: Precision: ±0.003mm

    D: Rate of hole diameter and thickness 0.85:1

    E: Stamping material thickness:0.05-2.0mm

    F: zero or less loss of material use.


    METS Precision-Tool uses a variety of 2D and 3D cad/cam Software to develop, design, and plan the layout of our dies. (see below for the full software list & details). We have the resources to build a die for any application. When high volumes of production are expected, we can build a dependable tool with longevity in mind. We can also produce low-cost tools for prototyping and sampling applications. Die protection is always on our mind, and DACO Precision-Tool can build in sensors that will help prevent costly damage to the die.


    Tool&Die​ Profile

    General CapabilitiesDesign Modeling 2D, 3D,processing,assemblingDie Location Technical SupportInspection
    Detail Tooling DocumentationDFMEA/PFMEAQuick Building Prototypes
    Die TypesForming DiesPrecision Progressive Stamping DiesSecondary Dies
    High Speed Steel Stamping DiesPrecision Blanking DiesForming Die
    Tooling MaterialCarbide(CD650,V3,KD20)ASP-23ASP-60
    S55C---45#55AL7075SKD11
    Tooling Life50 Million to 1000 Million Times
    Die Concept2-Plate Die3-Plate DieModule Die
    Production EquipmentCNCSODICK Nice Surface EDMP/G
    DrillSODICK Wire Cutting MachineJ/G
    Milling MachineWAIDA Profile Grinder Machine 
    Stamping EquipmentAIDAPURDERMICO
    MICO  
    Stamping ProductCustom StampingSIM shrapnelSpring clip
    Battery shrapnelShield DrawingPress-Fit Terminal
    Lead FramePower Contact TerminalPC Terminal parts
    Additional Services ProvidedCustom PackingPackagingHeat Treat
    Plating  
    Delivery3-5 Week3-6 Week4-7 Week

    We accept your any request on shipment.By air, by sea,and by Express are acceptable.

     By ExpressBy AirBy Sea
    West Europe3-5 days4-6 days22-30days
    USA &Canada3-4days5-6 days16-27days
    South Asia3-5 days3-7 days12-20 days
    Japan&South Korea2-3 days3-4 days10-13 days
    Russia-----------------30-40 days

    Packing:

    First Step Wrapping by PE film to anti-rust.

    Second wooden case without need of fumigation.Or as your required.


    FAQ

    Q: What’s your manufacture capability?
    ---- We use Sodick/Charmilles to frabricate die inserts,dimension we can do is +/-0.002mm.

    Q: Can you make all the dimensions are according to our design/samples?
    ---- We can guarantee that all the dimensions are made according to your drawing/sample.Please notice that dimension tolerence we can do is +/-0.003mm.

    Q: Did the stamping die suit for my press machine?
    --- The stamping die is made according to your press machine’s specification.Before start making die parts,we will send the design for your approval.

    Q: What’s your advantage compare with other supplier’s on the market?
    ---- We are stamping factory,have a team contains die design,making,maintance and stamping production.We know how important the good mold for stamping production.

    ---- All our engineers are with more than 10 years working experience.They are more professional on precision stamping field.

    ---- All the die parts we made are by Slow-speed wire EDM,can gurantee the dimension.Many of them make it by middle-speed wire EDM/fast-speed wire EDM


    Stamping die Shows:


    Product Tags:

    led lead frame

      

    ic lead frame

      
    Quality High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP for sale
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