2inch 3inch 4inch InP substrates for LD application, semiconductor
wafer,InP wafer,single crystal wafer
InP introduce
| InP single crystal |
 |
The tCZ growth (modified Czochralski method) is used to pull a
single crystal through a boric oxide liquid encapsulant starting
from a seed. The dopant (Fe, S, Sn or Zn) is added to the crucible
along with the polycrystal. High pressure is applied inside the
chamber to prevent decomposition of the Indium Phosphide. we has developed a process to yield fully stoechiometric, high purity
and low dislocation density InP single crystal.
The tCZ technique improves upon the LEC method thanks to a thermal
baffle technology in connection with a numerical modeling of
thermal growth conditions. tCZ is a cost-effective mature
technology with high quality reproducibility from boule to boule. |
Specification
| Item | Diameter | Type | carrying concentration | Mobility | Resistivity | MPD |
| S-InP | 2 | N | (0.8-6)X10^18 | (1.5-3.5)x10^3 | | ＜500 |
| 3 | ＜500 |
| 4 | ＜1x10^3 |
| Fe-InP | 2/3/4 | SI | | ＞1000 | ＞0.5x10^7 | ＞5x10^3 |
| Zn-InP | 2/3/4 | P | (0.6-6)X10^18 | 50-70 | | ＜1x10^3 |
| No dope InP | 2 | N | ＜3x10^16 | (3.5-4)x10^3 | | ＜5x10^3 |
| | Other |
| Orientation | (100)/(111)±0.5° | Flatness |
| TTV | Bow | Warp |
| ＜12um | ＜12um | ≤15um |
| 1st OF Flat | 16±2mm | 22±2mm | 32.5±2.5mm |
| 2st OF Flat | 8±1mm | 11±2mm | 32.5±2.5mm |
| Surface:1sp or 2sp ,2inch 350±25um,3inch 600±25um,4inch 625±25um,or
by customized |
2. InP Wafer process step
| InP Wafer processing |
|
| Each ingot is cut into wafers which are lapped, polished and
surface prepared for epitaxy. The overall process is detailed
hereunder. |
 |
| Flat specification and identification | The orientation is indicated on the wafers by two flats (long flat
for orientation, small flat for identification). Usually the E.J.
standard (European-Japanese) is used. The alternate flat
configuration (U.S.) is mostly used for Ø 4" wafers. |
|
| Orientation of the boule | Either exact (100) or misoriented wafers are offered. |
|
| Accuracy of the orientation of OF | In response to the needs of the optoelectronic industry, we offers wafers with excellent accuracy of the OF orientation : <
0.02 degrees. This feature is an important benefit to customers
making edge-emitting lasers and also to manufacturers who cleave to
separate dies allowing their designers to reduce the
real-estate wasted in the streets. |
|
| Edge profile | There are two common specs : chemical edge processing or mechanical
edge processing (with an edge grinder). |
|
| Polishing | Wafers are polished by means of a chemical-mechanical process
resulting in a flat, damage-free surface.we provides both
double-side polished and single-side polished (with lapped and
etched back side) wafers. |
|
| Final surface preparation and packaging | Wafers go through many chemical steps to remove the oxide produced
during polishing and to create a clean surface with stable and
uniform oxide layer that is ready for epitaxial growth - epiready
surface and that reduces trace elements to extremely low levels .
After final inspection, the wafers are packaged in a way that
maintains the surface cleanliness.
Specific instructions for oxide removal are available for all types
of epitaxial technologies (MOCVD, MBE). |
|
| Database | As part of our Statistical Process Control/Total Quality Management
Program, extensive database recording the electrical and mechanical
properties for every ingot as well as crystal quality and surface
analysis of wafers are available. At each stage of fabrication, the
product is inspected before passing to the next stage to maintain a
high level of quality consistency from wafer to wafer and from
boule to boule. |
Sample
QC. standard
Package ＆ delivery
FAQ:
Q: What's your MOQ?
A: (1) For inventory, the MOQ is 5 pcs.
(2) For customized products, the MOQ is 10-30 pcs up.
Q: What's the way of shipping and cost?
A:(1) We accept DHL, Fedex, EMS etc.
(2) If you have your own express account, it's great.If not,we
could help you ship them.
Freight is in accordance with the actual settlement.
Q: How to pay?
A: T/T, Paypal, Secure payment and Assurance payment.
Q: What's the delivery time?
A: (1) For the standard products
For inventory: the delivery is 5 workdays after you place the
order.
For customized products: the delivery is 2 or 3 weeks after you
place the order.
(2) For the special-shaped products, the delivery is 4 workweeks
after you place the order.
Q: Do you have standard products?
A: Our standard products in stock.
Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications for your
optical components based on your needs.
