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0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs

    Buy cheap 0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs from wholesalers
     
    Buy cheap 0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs from wholesalers
    • Buy cheap 0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs from wholesalers
    • Buy cheap 0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs from wholesalers

    0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs

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    Brand Name : Ziitek
    Model Number : TIC800P
    Certification : RoHs
    Price : negotiation
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 work days
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    0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs

    0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs


    TIC800P series is low melting point thermal interface material. At 50℃, TIC800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC800P series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

    TIC800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

    TIC800P-Series-Datasheet.pdf



    Applications Include:


    > High Frequency Microprocessors
    > Notebook and Desktop PCs
    > Computer Serves
    > Memory Modules
    > Cache Chips
    > IGBTs


    Features:


    > Lowest Thermal Resistance
    > 0.014℃-in² /W thermal resistance
    > Naturally tacky at room temperature, no adhesive required
    > No heat sink preheating required


    Typical Properties of TIC™800P series
    Product NameTIC™805PTIC™806PTIC™810PTest Method
    ColorPinkVisual
    Thickness0.005"/0.126mm0.008"/0.203mm0.010"/0.245mm******
    Thickness Tolerance±0.0008"/±0.0019mm±0.0008"/±0.0019mm±0.0012"/±0.030mm******
    Specific Gravity2.2 g/ccHelium Pycnometer
    Temperature range-25 to 125℃******
    Phase Change Softening Temperature50℃-60℃******
    Thermal conductivity0.95W/mKASTM D5470
    Thermal Impedance@50psi0.24℃-in²/W 0.15℃-cm²W0.053℃-in²/W 0.34℃-cm²W0.080℃-in²/W 0.52℃-cm²WASTM D5470

    Standard Thicknesses:0.005"(0.127mm)


    Standard Sizes:

    10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
    TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

    Peressure Sensitive Adhesive:

    Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

    Reinforcement:
    No reinforcement is necessary.


    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials.

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract.

    5.Free sample offer.

    6.Quality assurance contract.

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