PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

Features

>Thermal Conductivity: 0.8 W/mK
>High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
>High performance, thermally conductive acrylic adhesive
>Fire rating equate 94 V0

Applications

>Mount heat sink onto BGA graphic processor or drive processor
>Mount heat spreader onto power converter PCB or onto motor control PCB
>High performance, thermally conductive acrylic adhesive
>Can be used instead of heat cure adhesive,screw mounting or clip mounting

Standard Thicknesses:

0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)

Consult the factory alternate thickness.

Standard Sizes:

40" x 100'(1016mm x 30.48M) Individual die cut shapes can be supplied.

Reinforcement:

TIA™600P series The coil can be filled with PET.