| Sign In | Join Free | My burrillandco.com |
|
| Ask Lasest Price | |
| Brand Name : | UNICOMP |
| Model Number : | AX8300 |
| Certification : | CE, FDA |
| Price : | can negotiate |
| Payment Terms : | T/T,L/C |
| Supply Ability : | 30 sets per month |
| Delivery Time : | 30 days |
IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization
The AX-8300 is designed to address PCBA high resolution inspection
requirements. The AX-8300 is the FIRST machine in the industry to
utilize a special 110kV micro focus x-ray source! This is the
Perfect “In Between” design that offers a solution when 90kV is not
enough energy and 130kV is too much.
Using a state of the art FPD (Flat Panel Display) detection, the
AX-8300 can generate extreme high magnification/resolution images
that are similar to the highest resolution 90kV x-ray tubes can
produce. Additionally, the AX-8300 offers 360 degree table rotation
providing unlimited image views.
Model | AX8300 |
Max kV/type | 110 kV/Sealed |
Max. power | 25W |
Min.Resolution | 5μm |
Geometric magnification | 48.8X |
Imaging system(Option) | Flat Panel Detector |
Monitors | 22" LCD |
Dimensions | 1215x1325x1700mm |
Weight | 1350kg |
Radiation safety2 | <1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm |
Control | Keyboard/Mouse/Joystick |
Automated inspection | Standard |
Primary applications | Chip inspection/Electronic components/Auto parts.etc |
1.Focal spot size is a variable.Please consult the unicomp 2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission. | |
Features:
110kV Microfocus x-ray source,
High resolution FPD
X/Y/Z/Tilt Motions (table, tube, FPD)
360° Table Rotation
Angle View up to 70 Degrees
Point and Click Location Navigation
CNC Programming for Multiple Image Inspection Routines
Max Inspection Area 360 x 340mm
Application:
1.BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2.QFN:Bridging,Voids,Opens,Registration
3.SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4.Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5.Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images:

|
| Company Info. |
| Unicomp Technology |
| Verified Supplier |
| View Contact Details |
| Product List |