Heat retardant Flexible pcb Polyimide with SMT service FPCB board
Number of Layer: Single sided
Board material: PI
Copper thickness: 1OZ
Surface finishing: Immersion gold
Flexible Printed Circuit Board (abbr. FPCB) .
FPCB is minimization, slimness, high technology for whole digital
products which are getting smaller, slimmer.
Compare with the rigid printed circuit board , FPCB has the
following advantages
1. Light, thin, short, small, flexible structure, can be bent,
curled, folded, and three-dimensional assembly, adapter can replace a lot of parts, easy to
use maximum available space, making electronic products become more slim in appearance, widely
used has a small, lightweight and mobile requirements of all kinds of electronic products.
2. High heat resistance, can produce higher density and finer pitch
products to meet the high density interconnect between the components and the high stability
requirements, so that a larger increase the quality of the signal output.
3. Can be wound transfer roller processing methods (Roll-to-Roll),
easily automated, mass production,improve production efficiency.
FPC Process Capability
| Items | FPC Process Capability |
| Number of Layers | Single Sided, Double Sided, Multilayer, Rigid-flex PCB |
| Based Material | PI, PET |
| Copper Thickness | 9um,12um,18um,35um,70um,105um |
| Largest Board Area | 406mm X 610mm/16"X 24",The largest could be 7 meters length in
Single sided Flexible Printed Circuit Board |
| Minimum Hole Diameter of Mechanical Drilling | 0.2mm/0.008" |
| Minimum Hole Diameter of Laser Drilling | 0.075mm/0.03" |
| Minimum Hole Diameter of Hole-punching | 0.50mm/0.02" |
| Tolerance of Plated Through Hole | +/-0.05mm/±0.02" |
| Minimum Line Width | 0.075mm/0.003" |
| Minimum Line Spacing | 0.075mm/0.003" |
| Peel Strength | 1.2kg f/cm |
| Shape Processing | Die Stamping, Cutting, Laser Prototyping |
| Appearance of Tolerance | +/-0.05mm/ +/-0.02" |
| Solder Mask Type | PI Solder Mask Coverlay Film or PET Solder Mask Covelay Film
Lamination
|
| Multi-colored Liquid Photo-Imageable solder Mask Ink, Thermosetting
Solder Mask Ink |
| Surface Treatment | Plating Tin, Immersion Tin, Plating Nickel Gold, ENIG (Electroless
Nickel Immersion Gold),Immersion Nickel Gold, Chemical Nickel
Gold,OSP (Organic Solderability Preservatives), Immersion Silver
|
Application For Whole Digital Products
Packing and Delivery
Packing
1. Firstly hermetic plastic bag fill with products,
2. Then bubble sheet separates them,
3. Finally paper carton packing.
Delivery
1. It would take 7-9 days to mufacture it after deposit
received.Production time would depend on your drawing and process
plan.
2. DHL,FedEx, UPS delivery. It is faster than vessel.Barely
deliever it by vessel.
