Semiconductor Ceramic Wafer Chucking Substrate for Picking Up Wafer
Key word: Ceramic Wafer Chucking Substrate
Products : Ceramic Chucks and wafer end-effectors
Ceramic Chucks and end-effectors are used to manipulate and carry
silicon wafers through the whole production process. The chemical
inertness of ceramics allows those components to be
contamination-free for the wafer in particular in chemical wet
etching baths.
These items enable the handling of large-size wafers and can be
designed with vacuum channels in order to hold the part.
Applications Ceramic components can be used in the following
semiconductor process equipment :
- Deposition and ion implant machines
- Chemical wet etching equipment
- Failure-analysis machines
- Electrostatic chucks
Mingrui Ceramic can offer the following products :
- Insulator plates for electrostatic chucks (E-chucks)
- Base plates for thermo chucks
- End-effectors
The most commonly used ceramic materials are :
- Alumina – or aluminium oxide – 95 % alumina ceramic minimum
- zirconia
Ceramic wafer suction plate play a key role on the wafer transfer
equipment as automatic wafer unloader and wafer loader machinery .
LPCVD ceramic wafer vaccum suction plate are mainly used in the
solar semiconductor thin film making , like the diffussion wafer
load and unload machine . It used for wafer loading and unloading .
Heat-resistant, non-damaging handling arms provide high
functionality.
A heat-resistant, damageless handling arm. We can apply coatings
such as Diamond Like Carbon (DLC) to the ceramic surface for
enhanced functionality that mitigates damage to wafers / glass
panels and prevents contamination from diffusing.
Mingrui Manufacture zirconia Ceramic wafer boat used on automatic
wafer handling system diffusion furnace . As zirconia ceramic with
the charactheristic of wear resistant , high temperature resistant,
ceramic wafer boat is a good choice for wafter carrier .
Integrated wafer loading& unloading, unloading the diffused wafers
from the ceramic wafer boat
to the cassette or loading the textured wafers from the cassette to
the ceramic wafer boat . Available for double back-to-back wafers in one slot in ceramic wafer boat which realize single side diffusion or available for single wafer
in a slot for double side diffusion process. With continuous wafer
loading&unloading can guarantee the continuous production . Or
be used only for wafer loading or unloading is also available.
A
ceramic wafer boat for housing a semiconductor or a solar wafer comprising
at least one wafer support member containing at least one slot
capable of receiving at least a portion of a peripheral edge of a
wafer, wherein in the wafer support member comprises silicon
carbide; and
at least one structural member for conveying the wafer boat into
and out of a processing device connected to the wafer support
member , wherein the structural member is comprised of a ceramic
material that is not silicon carbide.
Technical Characteristics
·With continuous wafer loading& unloading can guarantee the
continuous production. Or be used only for wafer loading or
unloading is also available.
·With perfect detection and alarm system which guarantees the
stable and automatic operation.
·With circulation method of the cassette baseplate which reduce the
labor intensity.
·Modular control program structure, highly repeatable and readable,
which is convenient for function expansion in future and
maintenance;
·With recipe data design which enables the equipment to work with
various kinds of ceramic wafer boat with different accuracy, while running equipment will follow the
boat No. automatically and retrieve the corresponding recipe data
without human intervention.
prameter :
Zirconia ceramic date sheet :
| Properties | Units | 95 Alumina | 99 Alumina | ZrO2 |
| Density | g / cm³ | 3.65 | 3.92 | 5.95-6.0g/cm³ |
| Water absorption | % | 0 | 0 | 0 |
| Coefficient of thermal expansion | 10-6/K | 7.9 | 8.5 | 10.5 |
| Modulus of Elasticity Young's Mod | GPa | 280 | 340 | 210 |
| Poisson's ratio | / | 0.21 | 0.22 | 0.3 |
| HV Hardness HV | MPa | 1400 | 1650 | 1300-1365 |
| Flexural Strength @ room temperature | MPa | 280 | 310 | 950 |
| Flexural Strength @700°C | MPa | 220 | 230 | 210 |
| Compressive Strength @ room temperature | MPa | 2000 | 2200 | 2000 |
| Fracture Toughness | MPa *m 1/2 | 3.8 | 4.2 | 10 |
| Heat conductivity @ room temperature | W/ m*k | 18-25 | 26-30 | 2-2.2 |
| Electrical Resistivity @ room temperature | Ω*mm2 /m | >1015 | >1016 | >1015 |
| Max use temperature | °C | 1500 | 1750 | 1050 |
| Resistance to acid alkaline | / | high | high | high |
| Dielectric Constant | / | 9.5 | 9.8 | 26 |
| Dielectric Strength | KV/mm | 16 | 22 | / |
| Thermol Shock Resistance | △ T ( °C ) | 220 | 180-200 | 280-350 |
| Tensile Strength @ 25 °C | MPa | 200 | 248 | 252 |
To see how we can assist you with your semiconductor industry ,
contact us today.
Industrial Ceramic Intriduction
Aluminium Oxide, Al2O3 is the most widely applied and cost
effective technical ceramic material. It offers a combination of
superior mechanical strength and electrical properties, wear
resistance and corrosion resistance. The maximum working
temperature is up to 1700 °C with relatively high thermal
conductivity. It is also an electrically insulating material with a
high electrical resistivity. The good corrosion resistance makes it
insoluble in water and slightly soluble in strong acid and alkaline
solution.
Company Introduction
Mingrui ceramic manufacture and provides alumina ceramic components
for a wide range of application like Mechanical Equipment,
Electronic & Electrical, Oil Drilling, Medical, Chemical Industry
etc. According to actual application and customer's requirement,
the purities vary from 95%-99.7% and the forming methods will be
different. The forming methods applied in our plant include dry
pressing, isostatic pressing, injection moulding, extrusion
moulding. With experienced engineers and talented workers, we are
confident to offer high quality, high precision, complex components
for customers worldwide.
Mingrui Ceramics has years of experience designing and developing
technical ceramic solutions for a wide variety of applications and
industries. High Temperature Refractory Machining Ceramic Parts
Laser Equipment. We offer this expertise to all of our customers to
ensure the best design and materials are chosen for their specific
application and needs. High Temperature Refractory Machining
Ceramic Parts Laser Equipment, Typically, our custom technical
ceramic components and parts we supply are used for one of three
main reasons:
FAQ
Q: Are you trading company or manufacturer ?
A: We are factory.
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is
15-20 days if the goods are not in stock, it is according to
quantity.
Q: Do you provide samples ? is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay
the cost of freight.
Q: What is your terms of payment ?
A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 30%
T/T in advance ,balance before shippment.
If you have any other question, pls feel free to contact us .
