Excellent adhesion to etching resist HTE 70 mic electrolytic copper
foil for CCL
.Detail Specification:
| Single side treatment in red. |
| Thickness: | 0.009-0.070 mm. |
| Width | 5-1290mm. |
| Length | 500-5000 M. |
| Roll weight | 100kgs~500kgs |
| splice | under 2 |
Product Description:
. Good etch ability.
. Excellent adhesion to etching resist.
. Anti foil cracking by high elongation at elevated temperature.
. Eco-friendly products and processes.
Classify:
The ED copper foils for PCB can be divided into below parts:
(STD-E)- (HD-E)- (HTE-E)- (LP-E)- (VLP-E).
Use for :
CCL,Polyimide board,Epoxy board,PCB and antenna PCB.
Compare between CA copper foil and ED copper foil.
1. Process: rolled copper foil (Rolling process),ED copper foil
(Electrodeposition process)
2. Strength toughness: rolled copper foil is a flaky crystalline structure, so the
strength and toughness is better than electrolytic copper foil, so
most of the rolling copper foil used in flexible printed circuit
boards.
3. Width: rolling copper foil width ≤ 620mm, electrolytic copper foil width
≤ 1380mm
Package:wooden carton
FAQ:
Q1. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery.
Q2. Is it possible be zinc free copper foil?
Yes ,it is possible.
Q3. How to save after the box opened?
Keep the dry environment,and is better use it in 30days.
HTE copper foil with high elongation copper foil at high temperature
| Thickness | um | 9 | 12 | 18 | 25 | 35 | 70 | IPC 4562 4.6.3.1
|
| Area weight | g/m² | 80±1 | 107±3 | 153± | 215±5 | 285±5 | 585±8 | IPC 4562 4.6.3.2 |
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | IPC 4562 4.6.9 |
| (RZ) | μm | <6.0 | <6.5 | <8.0 | <9.0 | ≤10.0 | <15 |
Copper≧ | % | 99.8 | IPC 4562 4.6.3.1
|
| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >300 | >300 | >280 | IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >15.0 | >18.0 | >18.0 | >18.0 | >18.0 | >18.0 |
| ElongationI | state normal | % | >3.0 | >3.0 | >5.0 | >6.0 | >10.0 | >10.0 | IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.0 | >2.5 | >2.5 | >3.0 | >5.0 | >5.0 |
| Peel strength | N/mm | >1.0 | >1.05 | >1.35 | >1.70 | >1.8 | >2.0 | IPC 4562 4.6.7 |
High temperature oxidation resistance(200℃, 40min) | No color change | Standard |
| Solderability | Good | Standard |
| Solderability | Good | IPC 4562 4.6.12 |
Standard Width,1295(±1)mm,May according to the customer request
tailor.We test the peel strength with FR-4(Tg140) prepreg ,please
reconfirm with your pp.
