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Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface

    Buy cheap Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface from wholesalers
     
    Buy cheap Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface from wholesalers
    • Buy cheap Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface from wholesalers

    Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface


    Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface



    Key specifications:


    Material: Rogers
    Layer: 4 Layer
    Copper thickness: 1oz
    Surface finish: Immersion Gold
    Size:199*59mm
    Buried and blind hole: no
    Application: gas detector, remote control, telecommunication products

    Reference - our production capability for rigid PCB:
    Layers: 1 to 28
    Board finished thickness: 0.2 to 7.0mm
    Materials: FR4,Rogers,Taconic
    Max. finished board size: 23 x 25 (580 x 900mm)
    Min. drilled hole size: 3mil (0.075mm)
    Min. line width: 3mil (0.075mm)
    Min. line spacing: 3mil (0.075mm)
    Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
    Immersion Silver/gold,OSP, gold plating
    Copper thickness: 0.5-7.0oZ
    Solder mask color: green/yellow/black/white/red/blue
    Copper thickness in hole: >25.0µm (>1mil)
    Inner packing: Vacuum packing/plastic bag
    Outer packing: Standard carton packing
    Shape tolerance: ±0.13
    Hole tolerance: PTH: ±0.076 NPTH: ±0.05
    Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
    Special requirements: buried and blind Vias + controlled impedance + BGA
    Profiling: Punching, routing, V-CUT, beveling
    Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products



    Main Export Markets:
    Eastern Europe
    North America
    Mid East/Africa
    Western Europe
    Asia
    Central/South America


    Primary Competitive Advantages:
    Experienced Staff
    Green Product
    Packaging
    Price
    Prompt Delivery
    Quality Approvals
    Small Orders Accepted


    Parameter:

    o Item Data
    1 Layer: 1 to 24 layers
    2 Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3 Board thickness:0.20mm to 3.4mm
    4 Copper thickness:0.5 OZ to 4 OZ
    5 Copper thickness in hole:>25.0 um (>1mil)
    6 Max. Board Size:(580mm×1200mm)
    7 Min. Drilled Hole Size:4mil(0.1mm)
    8 Min. Line Width:3mil (0.075mm)
    9 Min. Line Spacing:3mil (0.075mm)
    10 Surface finishing:HASL / HASL lead free, HAL, Chemical tin,
    Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11 Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12 Shape tolerance:±0.13
    13 Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14 Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15 Certificate:UL,SGS,ISO 9001:2008
    16 Special requirements:Buried and blind vias+controlled impedance +BGA
    17 Profiling:Punching, Routing, V-CUT, Beveling


    Applications:
    Amplifier Combiner Coupler Mixer Multiplexer Power divider WiFi
    WiMAX, LTE bands 3G and 4G antenna


    Typical Applications:

    • Space Saving Circuitry
    • Patch Antennas
    • Satellite Communications Systems
    • Power Amplifiers
    • Aircraft Collision Avoidance Systems
    • Ground Radar Warning Systems
    • Datalink on cable systems
    • Remote meter readers
    • Power backplanes
    • LMDS and wireless broadband
    • Base station infrastructure

    Parameter:


    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling


    Karen-Sales Department
    ShenZhen Xinchenger Electronics Co.,Ltd
    sales3@xcepcb.com
    Skype:karen-xcepcb

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