Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing
Specifications
1. PCB design & fabrication
2. Material Sourcing Service
3. SMD assembly and Through hole components insertion
4. IC pre-programming / Burning on-line
5. Function testing as requested
6. Complete Unit assembly ( which including plastics, metal box,
Coil, cable inside etc)
7. Packing design
Our advanced equipment, process flows in SMT, DIP assembly and high
Standard Operation Procedure (SOP) are the fundamental assurance of
providing high quality assembly service. The excellent soldering
skills to our experienced employee on the production line, and the
comfortable clean working environment ensures the quality of our
strong processing capacity.
All of our products are produced under strictly observation of the
ISO9001: 2000 and conform to the ROHS standard. We always take
customer's satisfaction as our principle pursuit, " Good quality
with reasonable price", "Quick delivery".
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil,
cable assembly etc)
Packing design
Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI
minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
Advantages:
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supported capabilities
