TFT LCD Assembly/ Repair Bonder

TFT LCD Assembly/ Repair Bonder

1、The definition of TFT LCD Assembly/ Repair Bonder equipment XCM71-A6:
TFT LCD Assembly/ Repair Bonder equipment referred to as "state machine equipment" "hot press," using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached a ACF. use head pressure, head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF glue which is between the PCB so that it can conduct.

5、About the basic parameters of TFT LCD Assembly/ Repair Bonder equipment XCM71 -A6
Input Power: AC220V 50-60Hz
Working pressure :0.4-0 .8 Mpa
Operating modes: 7-inch HMI
Dimensions: L2210 × W1730 × H1500 mm
The method of Heating: heating or pulse heating thermostat
The quantity of Fixture: 2 group X-Y-θ micrometer adjustable
Range of Temperature : RT-500
Control program: PLC controller
Body main material: Steel + baking varnish
The thermocouple: K type

Shenzhen Sunsom automatic equipment Co.,Ltd .

is a high-tech enterprise specialized in R&D,manufacturing and sales of LCD automatic equipment.we stick to the the enterprise spirit of " efficiency and practicality",have successfully developed，

Constant Heat Bonding Machine,Pulse Heat Bonding Machine ,ACF Taking Machine,automation bubble-removing Machine,Polarizer Delaminator,HSC Bonding Machine ,large size TFT Bonding Machine ,PDP Bonding Machine,COG Alignment Machine,COG Bonding Machine,COG Previous Testor,COG Final Testor,ITO Tester,Opencell Testor and etc.These machines are widely applied to flat panel TFT/LCD .PDA,PDA;soldering of FPC and FFC to PCB ;polarizer removing,polarizer laminating,ACF laminating,polarizer claving process as well as various flat panel displays bonding and connecting process.