Autoclave LCD Bubble Remove Machine Equipment for Iphone for Samsung LCD Repair

1. About the application field of Bubble Remove Machine equipment XCP52 - Q1 .

Bubble Remove Machine is widely used in capacitive touch screen, LCD modules, resistive touch screen production enterprise, mobile phones, laptops, tablet computers, LCD, LCM, POL, OCA, electronic paper, books and other production enterprises.

2、About the basic parameters of Bubble Remove Machine equipment XCP52 - Q1

2.1 input power. AC380V three-phase 50 to 60 hz
2.2 input source. ordinary dry air
2.3 rated power. 15 kw
2.4 the limit of pressure. 1.0 Mpa
2.5 process control. PLC controller
2.6 temperature range. RT - 100 ℃
Alarm system.
2.7 + buzzer alarm lamp
2.8 operating mode. 10 inch human-machine equipment interface
2.9 safety protection. pneumatic control multilevel protection
2.10 air circulation. magnetic seal linkage blades
2.11 quick open the door. automatic type
2.12 cavity material. all SUS304

3、About the functions and characteristics of Bubble Remove Machine equipment XCP52 - Q1.

3.1 using imported components, ensure the equipment precision and service life.
3.2 equipment stability, low noise, perfect appearance, high efficiency.
3.3 omron temperature control, temperature accurately.

Shenzhen Sunsom automatic equipment Co.,Ltd .

is a high-tech enterprise specialized in R&D,manufacturing and sales of LCD automatic equipment.we stick to the the enterprise spirit of " efficiency and practicality",have successfully developed，

Constant Heat Bonding Machine,Pulse Heat Bonding Machine ,ACF Taking Machine,automation bubble-removing Machine,Polarizer Delaminator,HSC Bonding Machine ,large size TFT Bonding Machine ,PDP Bonding Machine,COG Alignment Machine,COG Bonding Machine,COG Previous Testor,COG Final Testor,ITO Tester,Opencell Testor and etc.These machines are widely applied to flat panel TFT/LCD .PDA,PDA;soldering of FPC and FFC to PCB ;polarizer removing,polarizer laminating,ACF laminating,polarizer claving process as well as various flat panel displays bonding and connecting process.