ACF bonding machine for glass IC on COG COF FPC ACF Tacking Machine ACF attached attach machine ACF laminating machine

ACFbondingmachinefor glass IC onCOGCOF FPC

ACF TackingMachine
ACF attached attach machine XCF50-A2

1.About the application field of ACF attached (pre-paste) machine XCF50-A2.

ACF attached (pre-paste) machine XCF50-A2 is mainly used in the process COG driver IC and LCD GLASS poor bonding after heavy maintenance cleaning. Such as. LCD TV, LCD monitors, notebook computers, LCD, LCM manufacturers and so on.

2.About the basic parameters of ACF attached (pre-paste) machine XCF50-A2.

2.1Device Power. AC220V 50-60Hz

2.2 Device Color. rack surface after paint handling, color is “sunsom" color

2.3 Weight. to prevail in kind

2.4 Dimensions. L450 * W400 * H360mm

2.5 Heating. heating thermostat

3、About the functions and characteristics of ACF attached (pre-paste) machine XCF50-A2.

3.1 is simple to operate, compact device

3.2 Time Setting flexible

3.3 Temperature control convenience

3.4 Cleaning shorter

Shenzhen Sunsom automatic equipment Co.,Ltd .

is a high-tech enterprise specialized in R&D,manufacturing and sales of LCD automatic equipment.we stick to the the enterprise spirit of " efficiency and practicality",have successfully developed，

Constant Heat Bonding Machine,Pulse Heat Bonding Machine ,ACF Taking Machine,automation bubble-removing Machine,Polarizer Delaminator,HSC Bonding Machine ,large size TFT Bonding Machine ,PDP Bonding Machine,COG Alignment Machine,COG Bonding Machine,COG Previous Testor,COG Final Testor,ITO Tester,Opencell Testor and etc.These machines are widely applied to flat panel TFT/LCD .PDA,PDA;soldering of FPC and FFC to PCB ;polarizer removing,polarizer laminating,ACF laminating,polarizer claving process as well as various flat panel displays bonding and connecting process.