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Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

    Buy cheap Fr4 High Frequency PCB Circuit Green For Wireless Communication Field from wholesalers
     
    Buy cheap Fr4 High Frequency PCB Circuit Green For Wireless Communication Field from wholesalers
    • Buy cheap Fr4 High Frequency PCB Circuit Green For Wireless Communication Field from wholesalers
    • Buy cheap Fr4 High Frequency PCB Circuit Green For Wireless Communication Field from wholesalers

    Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

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    Brand Name : XCE
    Model Number : XCEF
    Certification : CE,FCC,Rohs,ISO9001,SGS,UL
    Price : USD 1-500
    Payment Terms : Western Union, L/C, T/T
    Supply Ability : 10000000pcs / per month
    • Product Details
    • Company Profile

    Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

    Fr4 High Frequency PCB Circuit Green For Wireless Communication Field​


    Features:

    >Glass-reinforced hydrocarbon and ceramic dielectric

    >Excellent high frequency performance due to low dielectric tolerance and loss

    >Stable electrical properties versus frequency

    >Low Z-axis expansion and excellent dimensional stability


    Specification:


    Base Material: Fr4 high frequency
    Layer:2
    Thickness: 1.2MM
    Copper weight:1OZ
    Surface finish: Immersion gold

    Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

    With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.


    Applications:

    High frequency high frequency wireless communication

    High speed computer

    Satellite signal transmission equipment

    Microstrip and cellular base station

    Antennas and power amplifiers

    LNA/LNB


    Parameter:


    Layer No.1-16
    Min board thickness2 layer 0.2mm
    4 layer 0.4mm
    6 layer 0.6mm
    8 layer 0.8mm
    10 layer 1.0mm
    Max panel size508*610mm
    Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
    Wall hole copper thickness  >0.025mm(1mil)
    Finished hole0.2mm-6.3mm
    Min line width4mil/4mil(0.1/0.1mm)
    Min bonding pad space0.1mm(4mil)
    PTH aperture tolerance±0.075mm(3mil)
    NPTH aperture tolerance±0.05mm(2mil)
    Hole site deviation±0.05mm(2mil)
    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300v
    Min buried blind via0.2mm(8mil)
    Outer cooper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickness0.075mm-5mm
    Aperture0.2mm-0.6mm
    Quality Fr4 High Frequency PCB Circuit Green For Wireless Communication Field for sale
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