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Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

    Buy cheap Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control from wholesalers
     
    Buy cheap Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control from wholesalers
    • Buy cheap Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control from wholesalers

    Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

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    Brand Name : XCE
    Model Number : XCER
    Certification : CE,ROHS, FCC,ISO9008
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
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    Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

    Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control


    Specification

    PCB Type:

    FR4 PCB

    Layer :

    4 layer

    Min .Line Width/Space:

    8milmil/8mil

    Min. Via Diameter:

    0.3mm

    Finish Thickness:

    20mil

    Surface Finish:

    ENIG

    Size:

    3*6MM

    Material:

    KB FR4

    Color:

    green

    Application:

    aviation




    High frequency PCB Introduce:

    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2



    Parameter

    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300v
    Min buried blind via0.2mm(8mil)
    Outer cooper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickness0.075mm-5mm
    Aperture0.2mm-0.6mm
    Special technologyInpedance,blind buried via,thick gold,aluminumPCB
    Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating



    Description:

    FR4 Multi-Layer PCB refer to printed circuit board has more than two copper layers, such as 4L, 6L, 8L, 10L, 12L, etc. As technology improving, people can put more and more copper layers on the same board. Currently, we can produce 20L-32L FR4 PCB.
    By this structure, engineer can put trace on different layers for different purpose, such as layers for power, for signal transfering, for EMI shielding, for components assembly, and so on. In order to avoid too many layers, Buried Via or Blind via will be designed in multi-layer PCB. For board more than 8 layers, high Tg FR4 material will be popular than normal Tg FR4.
    More layers it is, more complex & difficult the manufacturing will be, and more expensive the cost will be. The lead time of multi-layer PCB is different from normal one, please contact us for accurate leading time.























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