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Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

    Buy cheap Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards from wholesalers
     
    Buy cheap Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards from wholesalers
    • Buy cheap Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards from wholesalers
    • Buy cheap Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards from wholesalers

    Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
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    Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

    Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards


    Specification:


    • Material: Rogers R4350
    • Layer counts: 6
    • Finish thickness: 2.72±10%mm
    • Min via diameter: 0.35mm
    • Surface finish: ENIG

    Parameter:


    Wall hole copper thickness  >0.025mm(1mil)
    Finished hole0.2mm-6.3mm
    Min line width4mil/4mil(0.1/0.1mm)
    Min bonding pad space0.1mm(4mil)
    PTH aperture tolerance±0.075mm(3mil)
    NPTH aperture tolerance±0.05mm(2mil)
    Hole site deviation±0.05mm(2mil)
    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300v
    Min buried blind via0.2mm(8mil)
    Outer cooper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickness0.075mm-5mm
    Aperture0.2mm-0.6mm
    Special technologyInpedance,blind buried via,thick gold,aluminumPCB
    Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating
    Quality Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards for sale
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