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Heavy Copper Plating Double Sided 2 Layer PCB Customized Printed Circuit Boards

    Buy cheap Heavy Copper Plating Double Sided 2 Layer PCB Customized Printed Circuit Boards from wholesalers
     
    Buy cheap Heavy Copper Plating Double Sided 2 Layer PCB Customized Printed Circuit Boards from wholesalers
    • Buy cheap Heavy Copper Plating Double Sided 2 Layer PCB Customized Printed Circuit Boards from wholesalers
    • Buy cheap Heavy Copper Plating Double Sided 2 Layer PCB Customized Printed Circuit Boards from wholesalers

    Heavy Copper Plating Double Sided 2 Layer PCB Customized Printed Circuit Boards

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCED
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Heavy Copper Plating Double Sided 2 Layer PCB Customized Printed Circuit Boards

    Heavy Copper Plating Double Sided PCB With Customized Technology Requirements


    Product type:


    Single-sided, double-sided and multilayer printed circuit boards (PCB), flexible (soft) of circuit boards, blind buried plate.
    Max size: single-sided, double-sided: 1000mm * 600mm MLB: 600mm * 600mm
    Highest Number of floors: 20 floors
    Processing board thickness: 0.4mm -4.0mm rigid plate flexible plate 0.025mm --- 0.15mm
    Copper foil substrate thickness: rigid plate 18μ (1 / 2OZ), 35μ (1OZ), 70μ (2OZ) flexible board 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm
    Common substrates: FR-4, CEM-3, CEM-1, 94HB, 94VO, poly vinyl chloride, polyester, polyimide ammonium.



    Process Capability:


    (1) Drilling: Minimum aperture 0.15MM
    (2) metal hole: Minimum aperture 0.15mm, thickness / aperture ratio of 4: 1
    (3) wire width: Minimum width: gold plate 0.075mm, 0.10mm tin plate
    (4) lead spacing: Minimum spacing: gold plate 0.075mm, 0.10mm tin plate
    (5) gold plate: Ni layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or according to customer requirements
    (6) HASL: tin layer thickness:> or = 2.5-5μ
    (7) paneling: Wire-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.2mm Minimum Shape tolerance: ± 0.12mm
    (8) outlet chamfer: angle: 30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm
    (9) V cut: angle: 30 degrees, 35 degrees, 45 degrees Depth: 2/3 thickness minimum size: 80mm * 80mm
    (10) off test:
    Resistance to soldering heat: 85 --- 105 ℃ / 280 ℃ --- 360 ℃
    Flexible sheet resistance flexing resistance / chemical resistance: full compliance with international standards


    Inspection:


    1. The main inspection hole metallization quality status, should ensure that the hole was no extra burr, black holes, holes and so on;
    2. Check the substrate surface dirt and other unwanted objects;
    3. Check the board number, drawing number, process documentation and process description;
    4. clarify racking parts, racking requirements and can withstand the plating tank plating area;
    5. plating area, the process parameters to be clear, to ensure the stability and viability of the electroplating process parameters;
    6. conductive parts cleaning and preparation, the solution was presented first energization process active;
    7. finds bath composition is checked, plate surface area status; such as the use of spherical anode bar installed, you must also check the consumption;
    8. Check the voltage solid case and the contact area, the current fluctuation range.



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