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| Brand Name : | HUASWIN | 
| Model Number : | HSPCBA1083 | 
| Certification : | ISO/UL/RoHS | 
| Price : | Negotiation | 
| Payment Terms : | T/T, Western Union, L/C | 
| Supply Ability : | 10,000pcs per month | 
| Delivery Time : | 15-20 working days | 
Plastics And Molds SMT PCB Assembly 8 Layer PCB Prototype Assembly
Specifications
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP
surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
Detailed Specification of PCB Manufacturing
| 1 | layer | 1-30 layer | 
| 2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. | 
| 3 | Board thickness | 0.2mm-6mm | 
| 4 | Max.finished board size | 800*508mm | 
| 5 | Min.drilled hole size | 0.25mm | 
| 6 | min.line width | 0.075mm(3mil) | 
| 7 | min.line spacing | 0.075mm(3mil) | 
| 8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP | 
| 9 | Copper thickness | 0.5-4.0oz | 
| 10 | Solder mask color | green/black/white/red/blue/yellow | 
| 11 | Inner packing | Vacuum packing,Plastic bag | 
| 12 | Outer packing | standard carton packing | 
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 | 
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 | 
| 15 | Profiling punching | Routing,V-CUT,Beveling | 
Detailed Specification of Pcb Assembly
| 1 | Type of Assembly | SMT and Thru-hole | 
| 2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free | 
| 3 | Components | Passives Down to 0201 Size | 
| BGA and VFBGA | ||
| Leadless Chip Carries/CSP | ||
| Double-Sided SMT Assembly | ||
| Fine Pitch to 08 Mils | ||
| BGA Repair and Reball | ||
| Part Removal and Replacement-Same Day Service | ||
| 3 | Bare Board Size | Smallest:0.25x0.25 Inches | 
| Largest:20x20 Inches | ||
| 4 | File Formats | Bill of Materials | 
| Gerber Files | ||
| Pick-N-Place File(XYRS) | ||
| 5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment | 
| 6 | Component Packaging | Cut Tape | 
| Tube | ||
| Reels | ||
| Loose Parts | ||
| 7 | Turn Time | 15 to 20 days | 
| 8 | Testing | AOI inspection | 
| X-Ray inspection | ||
| In-Circuit testing | ||
| Functional test | 
Factory view:

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| Company Info. | 
| Huaswin Electronics Co.,Limited | 
| View Contact Details | 
| Product List | 
 
                                 
                                 
                                 
                                