PowerElements Connectors
PowerElements are designed for high current sourcing and
distribution on Printed Circuit Boards (PCBs). They facilitate
various connections, including wire-to-board, component connection,
and fixation, such as screw locking for fuses, relays, and
conductor rails. Additional insulation bodies like twist protection
are available to prevent shorts. PowerElements can address
mechanical challenges like PCB connections within housings, in
interiors, or between PCBs. The two-piece PowerElement features a
press-fit design from both sides of the PCB, with bearing surfaces
protecting against mechanical stress. A wide variety of connection
options are available, including headless screws, thread nuts,
through holes, blind holes, and customizable installation heights,
connection surfaces, and thread/drill dimensions. PowerElements are
available in press-fit technology and Surface-Mounted Device (SMD)
solder technology, with SMD versions delivered blister-packed for
automated assembly. Application examples include attaching cables
to male threads, mounting fuses, high-current relays, battery
disconnecting switches, and midifuses.
Product Attributes
- Brand: PowerElements
- Certifications: REACH conform, RoHS conform (lead content under 4%
by weight)
- Material (Massive Pressfit Zone): CuZn39Pb3
Technical Specifications
| Technology | Feature | Current Carrying Capability | Operating Temperature | PCB Thickness (Min.) | Press Fit Force (Max.) | Retention Force (IEC 60352-5) | Tightening Torque |
|---|
| Massive Pressfit Zone | Male Thread | approx. 10 A per pin | -40C to +135C | 1.6 mm | 250 N per pin | min. 40 N per pin | M3: 0.5 Nm, M4: 1.2 Nm, M5: 2.2 Nm, M6: 3.9 Nm, M8: 9.0 Nm, M10:
17.0 Nm, M12: 35.0 Nm |
| Massive Pressfit Zone | Female Thread | approx. 10 A per pin | -40C to +135C | 1.6 mm | 250 N per pin | min. 40 N per pin | M3: 0.5 Nm, M4: 1.2 Nm, M5: 2.2 Nm, M6: 3.9 Nm, M8: 9.0 Nm, M10:
17.0 Nm |
| Massive Pressfit Zone | Angled | approx. 10 A per pin | -40C to +135C | 1.6 mm | 250 N per pin | min. 40 N per pin | M3: 0.5 Nm, M4: 1.2 Nm, M5: 2.2 Nm, M6: 3.9 Nm, M8: 9.0 Nm |
| SMD Solder Technology | SMD Pin | up to 200 A* | -40C to +155C | N/A | N/A | N/A | M3: 0.5 Nm, M4: 1.2 Nm, M5: 2.2 Nm, M6: 3.9 Nm, M8: 9.0 Nm, M10:
17.0 Nm |
| SMD Solder Technology | SMD Socket | up to 200 A* | -40C to +155C | N/A | N/A | N/A | M3: 0.5 Nm, M4: 1.2 Nm, M5: 2.2 Nm, M6: 3.9 Nm, M8: 9.0 Nm, M10:
17.0 Nm |
| SMD Solder Technology | SMD Socket with Through-hole Thread | up to 200 A* | -40C to +155C | N/A | N/A | N/A | M3: 0.5 Nm, M4: 1.2 Nm, M5: 2.2 Nm, M6: 3.9 Nm |
*Current carrying capability is subject to PCB thickness, cable
cross section, the soldering tin used as well as ambient
temperature.
