SOFNG SNO-019

Product Overview

The SOFNG SNO-019 is a NANO SIM card holder designed for SMT (Surface Mount Technology) applications. Featuring a push-push lever mechanism, it offers a reliable and stable connection with a tin-based gold plating for enhanced durability (24H salt spray resistance). The housing is constructed from high-temperature resistant plastic, making it suitable for demanding electronic assemblies. This product is RoHS compliant, indicating it is an environmentally friendly, lead-free product.

Product Attributes

• Brand: SOFNG
• Model: SNO-019
• Product Name: NANO SIM Card Holder / SMT
• Type: PUSH-PUSH Type
• Material: Contact: Copper Alloy (G/F) with 0.1m Ni Plated Overall; Housing: Thermoplastic UL 94V-0, Color: Black; Shell: Stainless SUS304 (G/F), Gold Plating; Lever: Stainless SUS304 (G/F), No Plating; Hinge: Stainless SUS304 (G/F), No Plating.
• Plating: Tin-based gold plating (24H Salt Spray)
• Certifications: RoHS (Lead-free)
• Origin: DONGGUAN SOFNG ELECTRONIC TECHNOLOGY Co., LTD

Technical Specifications

Usage Precautions

• Avoid using water-soluble flux as it may cause corrosion.
• When soldering terminals, avoid applying pressure to the product to prevent displacement, deformation, or degradation of electrical characteristics.
• For double soldering, allow the product to return to room temperature after the first soldering. Continuous heating can cause plastic deformation/aging, terminal loosening/disconnection, and reduced electrical characteristics.
• Prevent flux from infiltrating the product to avoid damage, contact failure, or malfunction.
• Refer to the product diagram for recommended dimensions for printed circuit boards and mounting hole patterns.
• During the overall assembly process, do not apply external force to the product.
• When used under low voltage conditions (below DC1V), poor contact may occur. This product is designed for DC resistance loads and should not be used with other loads (inductive loads, capacitive loads).
• Applying excessive operating force during use or testing may damage the product.
• Store in a cool, dry place at room temperature (25C, within 50% humidity), away from direct sunlight and corrosive gases. Use within 6 months from the date of delivery.

Disposal Information

Products do not belong to hazardous waste. When waste, it can be entrusted to a recycler for recycling and processing.

Transportation Precautions

During transportation, avoid direct contact with water, acidic or alkaline chemicals, or exposure to environments containing such gases. Be mindful of the risk of falling or tipping over. Avoid collisions or squeezing during transit. Maintain moderate temperature and humidity (room temperature 25C, within 50% humidity) to prevent material deformation or oxidation.

Welding Conditions

Hand Soldering

• Soldering Iron: 350C max., 3s max., 60W max.
• Immersion Soldering: 260C max., 5s max.

Reflow Soldering (for SMT products)

• Heating Method: Far-infrared upper and lower heating.
• Temperature Measurement: Use 0.1~0.2 CA(K) or CC(T) to measure at the solder joint (tin/copper foil surface).
• Fixing Method: Use heat-resistant tape.
• Temperature Distribution:
  • Preheating: 150-180C, 120 sec max.
  • Peak Temperature: 260C max., 3 sec max.
  • Cooling: 3 to 4 min.