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Dye System Acid Copper Plating Additives Dye Based Acid Copper Plating Process

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RUBIN F 2000 Dye-Based Acid Copper Process

Performance & Features

Operating Parameters

Item	Concentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O)	195–255 g/L
Pure Sulfuric Acid (SG=1.84 g/mL)	27–38 mL/L
Chloride Ion (Cl⁻)	80–150 mg/L
2000 Make-Up Agent	8–10 mL/L
2000 A Leveler	0.4–0.6 mL/L
2000 B Brightener	0.3–0.6 mL/L
Operating Temperature	20–30 ℃
Cathode Current Density	1–6 A/dm²
Anode Current Density	0.5–2.5 A/dm²
Anode Material	Phosphor copper balls (0.03–0.06% P)
Operating Voltage	1.0–6.0 V
Agitation	Air agitation + mechanical agitation

Product Tags:

Dye System Copper Plating Additives

Company Info.

Wuhan Aobong Surface Technique Co., Ltd.

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