| Terminal Strength | No removal or split of the termination or other defects shall
occur. | Solder the chip to the testing jig (glass epoxy board shown in Fig.
5.4.1-1) using eutectic solder. Then apply a force in the direction
of the arrow. 2N force for 0603 series, 5N force for 1005 and 1608
series, 10N force for 2012 series. Keep time: 10+1s. |
| Resistance to Flexure | No visible mechanical damage. | Solder the chip to the test jig (glass epoxy board shown in Fig.
5.4.2-1) using a eutectic solder. Then apply a force in the
direction shown in Fig. 5.4.2-2. Flexure: 2mm. Pressurizing Speed:
0.5mm/sec. Keep time: 30 sec. |
| Vibration | No visible mechanical damage. | Solder the chip to the testing jig (glass epoxy board shown in Fig.
5.4.3-1) using eutectic solder. The chip shall be subjected to a
simple harmonic motion having total amplitude of 1.5mm, the
frequency being varied uniformly between the approximate limits of
10 and 55 Hz. The frequency ranging from 10 to 55 Hz and returning
to 10 Hz shall be traversed in approximately 1 minute. This motion
shall be applied for a period of 2 hours in each 3 mutually
perpendicular directions (total of 6 hours). |
| Dropping | No visible mechanical damage. | Drop chip inductor 10 times on a concrete floor from a height of
100. |
| Solderability | No visible mechanical damage. Wetting shall exceed 80% coverage. | Solder temperature: 240+2C. Duration: 3 sec. Solder:
Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Resistance to Soldering Heat | No visible mechanical damage. R25 change: within +5%. B Constant
change: within +2%. | Solder temperature: 260+3C. Duration: 5 sec. Solder:
Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. The chip
shall be stabilized at normal condition for 1~2 hours before
measuring. |
| Thermal Shock | No visible mechanical damage. R25 change: within +5%. B Constant
change: within +2%. | Temperature: -55C 30 min. -> Ambient -> 125C 30 min.
Transforming interval: 20sec. (max.). Tested cycle: 100 cycles. The
chip shall be stabilized at normal condition for 1~2 hours before
measuring. |
| Low Temperature | No visible mechanical damage. Resistance to R25 change: within +5%.
Low B Constant change: within +2%. | Temperature: -55+2C. Duration: 1000* hours. The chip shall be
stabilized at normal condition for 1~2 hours before measuring. |
| Resistance to High Temperature | No visible mechanical damage. R25 change: within +5%. B Constant
change: within +2%. | Temperature: 125+2C. Duration: 1000* hours. The chip shall be
stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. R25 change: within +5%. B Constant
change: within +2%. | Temperature: 60+2C. Humidity: 90% to 95% RH. Duration: 1000**
hours. The chip shall be stabilized at normal condition for 1~2
hours before measuring. |
| Loading at High Temperature (Life Test) | No visible mechanical damage. R25 change: Within +5%. B constant
change: Within +2%. | Temperature: 85+2C. Duration: 1000 hours. Applied current: Max.
Permissive Operating Current. The chip shall be stabilized at
normal condition for 1~2 hours before measuring. |
