| Products Name : | SHOMEA High-Precision Solid Tip Needle |
| Material: | Stainless Steel, Brass, Aluminum, brass, copper ,etc |
| Surface treatment : | Sandblasting, polishing, knurling, laser marking, etc |
| Tube Outer Diameter : | 0.25-15mm |
| Tube wall Thickness : | 0.05-3mm |
| meta Base | Male and Female thread |
| Tolerance : | OD/ID±0.02mm L±0.05mm or According to Drawing |
| Size: | 3G-32G or Customized |
| LOGO | Can be customized according to your drawing |
| Samples: | Usually provide 5-10pcs samples for testing before mass production |
| Delivery Time: | usually 5-25days or according to quantity |
• The tip and shaft surfaces achieve high-level finish (e.g., Ra≤0.2μm), feeling as smooth as a mirror. This ultra-low friction
coefficient surface not only effectively prevents scratching of fragile gold plating or
precision components when contacting PCBs but also minimizes the adhesion of dust and
flux, extending the tip's lifespan and reducing the risk of short
circuits caused by foreign matter.
FAQs:
Q: Why is a solid structure adopted? What are its advantages in
electronic testing compared to hollow needles?
A: The solid structure adopts a fully solid forged process, with no internal hollow channels and extremely high
density. Compared to hollow needles, it possesses superior longitudinal compression and bending resistance, making it less prone to deformation during high-frequency
loading/unloading or test insertions and withdrawals, thereby
ensuring testing position accuracy. Furthermore, the solid
structure provides a superior conductive path, effectively reducing contact resistance and ensuring stable,
efficient transmission of weak or high-frequency signals, making it
particularly suitable for precision testing of high-density PCBs or
micro-components.
Q: What is the precision level of the needle tip? Is it suitable
for testing high-density electronic components?
A: The needle tip utilizes sub-micron grinding technology, with a tip diameter finely controllable down to micron or even sub-micron levels (specific to model, commonly 10-50μm). This extreme precision
allows it to easily penetrate tiny test points or narrow spacings,
accurately contacting the pads of high-density electronic
components (such as BGA chips, 0201 SMDs), effectively avoiding
short circuits or signal crosstalk between adjacent contacts,
meeting the stringent testing requirements of high-end electronic
manufacturing.
Q: What is the surface treatment process? Will it cause oxidation
or contamination to electronic components?
A: The tip and body undergo high-precision mirror polishing and passivation treatment, achieving extremely low surface roughness (Ra≤0.2μm) with no oil
residue or metal particles. The material itself has excellent
corrosion resistance (e.g., inertness of 316L stainless steel or
cemented carbide), preventing the formation of oxide layers or precipitates under normal operating conditions, ensuring cleanliness when
contacting sensitive electronic components, and effectively
preventing circuit board or chip failures caused by poor contact or
foreign matter contamination.
Q: What are the applicable scenarios for this tip needle? Can it be
customized?
A: This product is widely applicable in semiconductor testing (e.g., probe stations), PCB automated testing
(ICT/FCT), flying wire testing in mobile phone/tablet repair,
miniature connector inspection, and other scenarios. We support non-standard customization; exclusive solutions can be provided based on customers' specific
requirements (such as tip diameter, total length, taper angle,
thread interface type, special coating requirements, etc.),
ensuring perfect compatibility with your testing equipment.
