Sputtering Target Bonding Adhesive Process Friendly Stress Buffering

Target Bonding Adhesive is a specialized adhesive used to securely bond sputtering targets to the backing plate. It plays a key role in processes such as physical vapor deposition (PVD).

Core Advantages

● Process Friendly

It typically cures at temperatures from medium to low, avoiding potential damage to target material properties from high temperatures, and is relatively easy to operate.

● Stress Buffering

With certain flexibility, it effectively alleviates stress generated between the target and the backing plate due to differences in thermal expansion coefficients.

● Overall Performance Stability

It has good chemical and mechanical stability, strong adhesion to various substrates (such as aluminum, copper, stainless steel, glass), and is environmentally friendly and non-toxic.

Application Fields

● Ceramic and Brittle Target Bonding

Especially suitable for bonding ceramic targets such as ITO (Indium Tin Oxide) and SiO₂, which are brittle and require bonding for support and heat dissipation.

● Thermally Sensitive or Special Targets

Suitable for targets that cannot withstand high-temperature bonding (such as certain oxide targets), organic targets, or temporary bonding applications.

Sputtering Targets for PVD Thin-Film Deposition

APG manufactures metal, alloy, ceramic and rare earth sputtering targets for industrial PVD applications. Explore materials for semiconductor, photovoltaic, optical coating, display and Low-E glass applications.

Browse sputtering target materials, metal and alloy sputtering targets, ceramic sputtering targets and rare earth sputtering targets. APG also provides target bonding and backing plate services.

For a quotation, specify the material or composition, required purity, target shape and dimensions, quantity, backing plate and bonding requirements. Include a drawing and your deposition application where available. Contact APG about your sputtering target requirements.

About APG

Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people.

APG specializes in the research and development (R&D) and production of PVD materials (sputtering targets and evaporation materials), pastes, and powders. These products serve industries such as PV solar cells, optics, semiconductors, smart touch and display manufacturing, Low-E glass production, permanent magnets, power batteries, and decorative and functional coating applications.

APG utilizes leading production technologies, including sintering, plasma spraying, and melting. The company produces ceramic materials, compound materials, metals, and alloy materials, and also provides bonding and backing plate services. APG possesses the necessary technology and equipment to produce both powder and pastes.

APG maintains a strong technical team and R&D department, which accounts for more than 20% of the company's total employees. This team focuses on developing new materials and technologies and holds numerous patents. Additionally, APG operates an inspection center equipped with various instruments to guarantee the stable quality of all products. APG is committed to the research, development, and production of high-performance materials and delivering excellent service to its customers.