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Aluminium Oxide Ceramic Substrates

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Brand Name :	ZG
Model Number :	MS
Certification :	CE
Price :	10USD/PC
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	1000 PCS
Delivery Time :	5-8 work days

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Aluminium Oxide Ceramic Substrates

Aluminium oxide ceramic substrates

Ceramic substrates made of aluminum oxide Al2O3 are the basis for the creation of hybrid integrated circuits, ceramic capacitors, resistors, heaters, various semiconductor elements and electrical products.

The raw material for the production of vacuum-tight ceramics Al2O3 is corundum, so ceramics are often called not only "aluminum oxide", but also corundum ceramics. Vacuum-tight corundum ceramics are resistant to various acids and other aggressive media, and are an excellent durable insulator. Substrates made of Al2O3 do not lose their performance in case of sudden temperature changes.

An important role is played by the percentage of aluminum oxide in the total volume and its crystal lattice. They determine its future performance characteristics, such as thermal conductivity, hardness, bending strength, coefficient of specific expansion and others.

Specifications

Properties		Materials
Properties		Al2O3 94,4% (ВК-94ДН)	Al2O3 96,0% (ВК-96ДН)	Al2O3 99,6% (ВК-100ДН)
Colour		pink	white	white
Bulk density	г/см3	3,60	3,70	3,90
Surface roughness, Ra (grinding)	мкм	-	0,2-0,7	0,1
Surface roughness Ra (polished)	мкм	-	≤ 0,03	≤ 0,05
Mechanical properties
Flexural strength	МПа	280	350	500
Compressive strength	МПа			450
Elastic modulus	ГПа	-	330	330
Vickers hardness	ГПа	-	14	16
Fracture toughness		-	-	-
Physical properties
Coefficient of thermal expansion (40-300°C)	10 -6 /°C	6,5 - 7,5	6,5 ~ 7,5	6,2 ~ 7,2
Coefficient of thermal expansion (300-800 С)			6,5 ~ 8,0	6,5 ~ 8,2
Thermal conductivity (25°C)	Вт/м∙°K	15 - 20	≥ 24	≥ 30
Specific heat capacity	Дж/Кг∙°К	-	750	750
Dielectric strength			≥ 17	≥ 15
Volumetric resistance(25 С)			≥ 1014	≥ 1014
Dielectric constant (1 МГц)	-	9,0 - 10,0	9 ~ 10	10
Dielectric losses (1МГц, 25°C)	∙10 -4	4	2	2
Sizes
Distance between scribing lines, мм			1±0,05	1±0,05
Minimum hole diameter, мм			0,1±0,05	0,1±0,05
Thickness, мм			0,2 ~ 2,0	≤ 0,635
Thickness tolerance (min), мм			± 0,03	± 0,04
Dimensions (max), мм			139,7 x 190,5	120 x 120
Dimensional tolerance (min), мм			(+0,15 / -0,05)	±0,1; ±2
Metallisation
DBC technology		+	+	-
Thick-film technology		+	+	+
Thin-film technology		+	+	+

Application area

power electronics, converter equipment (radio communication devices, broadcasting equipment, medical electrical equipment, etc.);
insulation gaskets for heat removal from electronic components to the cooling radiator;
protectors for elements of piezoelectric converters;
auto electronics (multiplicated boards for resistors, rheostats, fuel level sensors, pressure sensors, LED headlights, electric power steering, ABS, ASR systems, etc.)
precision substrates for microwave GIS and microassemblies with a high density of holes and recesses for crystals;
carriers of sensor circuits of toxic substances, ionizing radiation, magnetic field, etc.;
semiconductor industry (thermoelectric modules and heat removal devices, analytical equipment, wireless power sources, energy-efficient waste heat disposal systems, electronical, laser and optical systems, LEDs (energy-saving technologies), IGBT modules

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Aluminium Oxide Ceramic Substrates

Aluminium Oxide Ceramic Substrates

Aluminium Oxide Ceramic Substrates

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aluminium oxide ceramic substrates

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high-performance ceramic substrates for electronics

Aluminium Oxide Ceramic Substrates

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