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High Precision CCD Automatic Positioning/online Pcb Router Machine

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High Precision CCD Automatic Positioning/online Pcb Router Machine

High Precision CCD Automatic Positioning Online PCB Router Machine
Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards
450×430 mm 15W UV PCB Separator / FR4 Board Laser Depaneling Machine with ±20 μm Precision
High Precision UV Laser PCB Depaneling Machine Close-up view of PCB laser depaneling process
Advanced Laser Depaneling Technology
  • Completely software-controlled laser process with adaptable processing parameters and laser paths for varying materials and cutting contours
  • UV laser cutting eliminates appreciable mechanical or thermal stresses on components
  • Minimal cutting channel requirement (few µm) enables higher component density on panels
  • Dual-mode system software separates production and setup processes to reduce operator errors
  • Integrated vision system with fiducial recognition operates 100% faster than previous versions
Laser Depanelizer Machine YASTM-4C operational view YASTM-4C machine control interface and components
YASTM-4C Laser Depanelizer Machine Features
  • High Precision Positioning: CCD automatic positioning with automatic focusing for fast, accurate operation
  • User-Friendly Design: Simple interface, easy operation, compact footprint, and rigorous security design
  • Energy Efficient: Reduced energy consumption for significant cost savings
  • High Performance: Cost-effective solution with fast cutting speed and stable performance
YASTM-4C technical specifications and dimensional overview Detailed view of laser depaneling machine components
YASTM-4C Technical Specifications
ParameterSpecification
Technical ParametersMain body of laser: 1480mm × 1360mm × 1412mm
PowerAC220 V
Laser Type355 nm
Laser SourceOptowave 10W (US)
Material Thickness≤1.2 mm
Precision±20 μm
Platform Precision±2 μm
Working Area600 × 450 mm
Maximum Power3 KW
Vibration ControlCTI (US)
Beam Diameter20±5 μm
Ambient Temperature20±2 ℃
Machine BaseMarble
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