Product Description
This 1.8H TF Card Socket Connector is a compact, high-reliability
Micro-SD card holder designed for small-form-factor electronics
requiring stable signal transmission and long insertion life. The
connector features a reinforced contact structure with gold-plated
terminals to ensure low contact resistance and excellent corrosion
resistance. The integrated Mylar insulation layer improves
durability, prevents short-circuit risks, and enhances card
retention performance.
Its low-profile design provides optimal space utilization for
compact PCB layouts, while the guided lock area supports smooth
card insertion and secure positioning during operation.
Manufactured using high-temperature LCP housing and
precision-formed terminals, the connector is suitable for
high-density consumer and industrial applications.
| Product Type | TF / Micro-SD Card Socket Connector |
| Structure | 1.8H low-profile, push-pull type with Mylar insulation |
| Mounting Type | PCB mount, SMT/Hybrid depending on layout |
| Terminal Material | Copper alloy with gold plating (per model requirement) |
| Housing Material | LCP high-temperature resin |
| Operating Voltage | 3.3V standard TF interface |
| Contact Resistance | ≤100 mΩ max |
| Insulation Resistance | ≥500 MΩ |
| Withstanding Voltage | AC 500V / 1 min |
| Operating Temperature | -40°C to +85°C |
| Insertion Life | 5,000 cycles min |
| Card Compatibility | TF / Micro-SD |
| Features | Gold-plated contacts, secure lock, reinforced terminal plating,
Mylar dust/insulation film |
| Dimensions | Refer to model-specific drawing (approx. 13.6mm length × 15mm width
× 1.8mm height) |
Applications
Smart wearable devices
Portable consumer electronics
IoT modules & communication products
GPS devices
Bluetooth / WIFI modules
Industrial handheld equipment
Data-logging devices
Precautions
Ensure correct PCB pad layout and reflow profile to avoid
deformation.
Avoid excessive insertion force; improper angle may damage terminal
contacts.
Keep the connector free from dust and debris to maintain stable
contact.
Follow ESD-safe handling procedures during assembly.
Verify card thickness and dimensions to ensure compatibility.
