TRI AOI TR7700 SIII 3D SMT AOI Machine for Smt Production Line
The TR7700 SIII 3D AOI combines the best of 2D and 3D technologies
with new generation software to revolutionize PCB assembly
inspection.
SMT Line Integration
Centralized production line management increases operator
productivity and response time.
TRI's integrated solution includes the following four components.
Offline Editor
This application allows for centralized independent adjustment and
fine tuning of inspection algorithms on previously scanned images
while providing immediate feedback. The completed program can then
be uploaded to the in-line inspection machines to improve
inspection stability and accuracy.
Control Center
The core component at the heart of a production facility, the
control center allows real-time monitoring and operation of
multiple inspection machines across production lines.
Yield Management System 4.0
YMS 4.0 provides real-time inspection status across SPI, AOI and
AXI systems and monitors SPC and Alarm status, and supports remote
fine-tune throughout the SMT line. The centralized inspection
management provides top 5 to 10 defects and defective images, OEE
review and management, issue and root cause drill down line by
line, by station and by process, which improves quality and
productivity analysis. YMS 4.0 supports Industry 4.0 initiative.
Quality Validation
Fully automated collection of good/failed images from a complete
production run allows testing, tuning and verification of adjusted
program parameters without reloading tested boards. This allows
engineers to save inspection time when fine tuning and
significantly speeds up New Product Introduction (NPI).
3D Inspection
Accurate laser sensor goes beyond other 3D technology boundaries.
Its high measurement range ensures that components up to 20 mm high
can be inspected with maximum precision. Working with laser light
also eliminates problems with black or mirror-like components on
low contrast background.
Interactive 3D models help operators quickly review found defects,
such as lifted BGA components, IC leads, connectors, switches and
other mounted devices for enhanced postreflow inspection.
Smart Library + Model Library
Smart Library speeds up programming by automatically allocating
inspection windows for IC leads.
New Color Space Algorithms
TRI’s new adaptive algorithms use color space processing to
increase inspection accuracy, reduce false calls and improve
inspection results while reducing time necessary for inspection
fine tuning and the number of alternative images required.
| Machine Model | TR7700SIII 3D |
| Optical System | |
| Imaging Method | Dynamic Imaging with true 3D profile measurement |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 µm, 15 µm ( optional ) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | Single/Dual 3D laser sensors |
| Max. 3D Range | 20 mm |
| Inspection Performance |
| Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec |
| 4 Mpix@ 15 µm 2D: 120 cm²/sec |
| 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* |
| 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* |
| * Depending on board size and laser resolution |
| Motion Table & Control |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 µm |
| Board Handling |
| Max PCB Size | TR7700 SIII 3D: 510 x 460 mm |
| TR7700L SIII 3D: 660 x 460 mm |
| TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm ( 5 mm optional ) |
| Conveyor | Inline |
| Height: 880 – 920 mm |
| * SMEMA Compatible |
| Inspection Functions |
| Component | Missing |
| Tombstoning |
| Billboarding |
| Polarity |
| Rotation |
| Shift |
| Wrong Marking (OCV) |
| Defective |
| Upside Down |
| Extra Component |
| Foreign Material |
| Lifted Component |
| Solder | Excess Solder |
| Insufficient Solder |
| Bridging |
| Through-hole Pins |
| Lifted Lead |
| Golden Finger |
| Scratch/Contamination |
| Dimensions |
| WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm |
| TR7700L SIII 3D: 1300 x 1630 x 1655 mm |
| TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm |
| Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7700 SIII 3D: 1030 kg |
| TR7700L SIII 3D: 1250 kg |
| TR7700 SIII 3D DL: 1150 kg |
Other machine
We are smt support provider for smt machine parts and equipment.
such as reflow solder oven, Wave Soldering Machine, Pick and Place
Machine, SMT PCB Printer, SMT AOI SPI Machine, SMT Reflow Oven, PCB
conveyor, smd counter, loader & unloader machine, nozzle / feeder,
feeder storage cart smt reel rack, smt grease, solder paste mixer,
KIC thermal profiler, smt tape, SMT Assembly line and so on.
wenzhan Techonologies Co.,Ltd
In 2009, Shenzhen wenzhan Technology Co., Ltd. was established to
build a more timely and effective communication platform, and
realize the company's service tenet of serving leading customers.
The engineers of the company are professional technicians who have
been certified by the original factory for more than 10 years. They
always adhere to the value of putting the interests of customers
first, and provide customers with high-quality equipment
accessories, consumables, fixtures and technical support services.
In order to effectively reduce the cost of customers, the company
set up a machining plant, and changed most of the feeder parts to
self-produced parts, so as to ensure sufficient inventory and
reduce the cost of customers at the same time.
Why Choose Us?
It is precisely because wenzhan technology has the following
advantages over the same industry that more and more customers
choose wenzhan as their preferred supplier.
- Professional pre-sales advice support
- Excellent after-sales technical service
- Flexible payment and return policy
- One stop solution for SMT accessories
- Stock in the factory with sufficient stock and fast delivery
