Precision Copper Etching Service for 10µm Ultra-Thin Metal Parts

Precision copper etching is a photochemical etching technique specifically designed for processing ultra-thin, high-precision copper metal components. This process primarily utilizes high-purity rolled copper materials as substrates, such as pure copper, brass, or phosphor bronze. Through the interaction between photosensitive films and chemical etching solutions, it achieves microfabrication of complex geometric shapes.

• Precision copper etching delivers burr-free, stress-free, and heat-affected zone-free results while preserving the material's inherent physical properties.
• Compared to traditional stamping processes, it reduces mold costs by 80%, supports rapid prototyping and design iterations, and is particularly suited for processing ultra-thin copper prone to deformation.
• It enables complex hollow structures unattainable through conventional machining.

1. Pre-treatment: Copper plate cleaning and surface activation
2. Coating: Uniform application of photoresist on both sides
3. Exposure: UV exposure through photomask
4. Development: Removal of uncured photoresist to form etching channels
5. Etching: Precise temperature and concentration control for dual-side etching
6. Stripping: Removal of residual photoresist
7. Post-treatment: Dimensional inspection and surface finishing

• Widely applied in high-end manufacturing sectors such as electronic connectors, electromagnetic shielding covers, flexible circuit boards, current sensors, RF components, and medical electrodes.
• It plays an irreplaceable role in producing critical components for industries including 5G communications, new energy vehicles, and aerospace.