Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP
Production Description:
Sapphire wafers are single‑crystal substrates grown from
high‑purity aluminum oxide (Al₂O₃) via processes such as the
Kyropoulos (KY) and Heat Exchanger Method (HEM). Their molecular
structure consists of three oxygen atoms and two aluminum atoms
covalently bonded in a hexagonal lattice. This structure endows
sapphire wafers with a range of superior properties, making them a
key material across multiple high‑precision and cutting‑edge
fields.
Product Parameters:
| Diameter: | 6inch or 150±0.1mm |
| Thickness: | 350±15um; 500 ± 15 um; 1000±15um |
| Roughness: | Ra ≤ 0.2 nm |
| Warp: | ≤ 15um |
| TTV: | ≤ 10um |
| Polish: | DSP (Double Side Polished); SSP(Single Side Polished) |
| Shape: | Round, Flat, Notch |
| Wafer Orientation: | C Axis to M Axis |
| Edge Form: | 45°, C shape |
| Material: | Sapphire |
| Remarks: | All specifications above can be customized upon your request. |
Product Pictures:
Product Highlights:
* Sapphire wafers are with common crystallographic orientations
include C‑plane (0001), A‑plane (11‑20), and R‑plane (1‑102); the
choice of orientation tailors optical, mechanical, and epitaxial
behavior for specific devices.
* Typical optical transmission spans the near‑UV to mid‑infrared
(approximately 0.19–5.5 μm), with high transparency in the 0.3–5 μm
range, supporting applications in optics and optoelectronics.
* Mechanical and thermal properties of sapphire wafers include a
Mohs hardness of 9, high strength and wear resistance, and a
melting point ~2050°C, enabling performance under extreme
environments.
* Chemical stability of sapphire wafers is excellent—resistant to
most acids and alkalis—with notable attack only by HF, phosphoric
acid, and molten KOH at elevated temperatures.
* Representative applications of sapphire wafers: LED substrates
(GaN on sapphire), infrared and laser windows, optical components,
and wear‑resistant covers in consumer electronics.
Related Product Recommendation:
2inch Spphire Wafer C Axis DSP:
Q&A:
Q: What is a sapphire wafer?
A: A sapphire wafer is a circular thin slice made of sapphire
material, which is widely used in the manufacturing of
semiconductors and optical devices.
Q: What size are sapphire wafers?
A: 2inch, 3inch, 4inch, 6inch, 8inch, 12inch.
Q: How to cut a sapphire wafer?
A: Cutting a sapphire wafer requires specialized methods due to its
extreme hardness (9 on the Mohs scale, second only to diamond) and
brittleness. The core approach relies on abrasive-based or
laser-based techniques to achieve precise, low-damage cuts.
