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Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

    Buy cheap Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter from wholesalers
     
    Buy cheap Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter from wholesalers
    • Buy cheap Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter from wholesalers
    • Buy cheap Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter from wholesalers

    Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100-32-05U
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

    Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter


    Company Profile


    Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assemblies.


    Features:

    > Good thermal conductivity: 3.2W/mK

    > Ultra soft and highly compliant
    > Self-adhesive without the need for additional surface adhesives
    > Good insulation performance

    > Easy release construction
    > Electrically isolating
    > High durability



    Applications


    > AI Servers, Inverters, Telecom Devices

    > Power tools
    > Network communication products
    > Electric vehicle batteries Computer CPU/GPU Cooling
    > New energy vehicle power systems

    > Display card
    > Mainboard/mother board
    > Notebook

    > Power supply
    > Heat pipe thermal solutions


    Typical Properties of TIF®100-32-05U Series
    PropertyValueTest method
    ColorBlueVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Density(g/cm³)3.0ASTM D792
    Thickness Range(inch/mm)

    0.010~0.020

    (0.25~0.5)

    0.030~0.200 (0.75~5.0)ASTM D374
    Hardness (Shore OO)6527ASTM 2240
    Recommended Operating Temperature-40 to 200℃***
    Breakdown Voltage(V/mm)≥5500ASTM D149
    Dielectric Constant3.5 MHzASTM D150
    Volume Resistivity>1.0X1012 Ohm-meterASTM D257
    Flame ratingV-0UL 94 (E331100)
    Thermal conductivity3.2 W/m-KASTM D5470
    3.2 W/m-KISO22007

    Product Specifications


    Standard Thickness: 0.010"(0.25 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
    Standard Size: 16"×16" (406 mm ×406 mm)


    Component Codes:


    Reinforcement Fabric: FG (Fiberglass).

    Coating Options: NS1 (Non-adhesive treatment),
    DC1 (Single-sided hardening).
    Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


    The TIF® series is available in custom shapes and various forms.

    For other thicknesses or more information, please contact us.


    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials.

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract.

    5.Free sample offer.

    6.Quality assurance contract.


    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Quality Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter for sale
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