Thermally Conductive Potting Compound HN-8808B - Black, 0.5 W/M·K,
EMI Shielding
Product Overview for Silicone Potting Compound:
The HN-8808B Black Potting Compound is engineered for
high-heat-density electronic devices. With a high thermal
conductivity of 0.5 W/M·K, it effectively transfers heat away from
hotspots, significantly lowering core component operating
temperatures. The black fillers also provide a degree of
Electromagnetic Interference (EMI) shielding, offering a dual
solution for thermal management and EMC compliance, thereby
extending device lifespan.
Key Performance Parameters for Silicone Potting Compound:
* Appearance (Mixed): Black elastomer
* Mix Ratio (A:B): 10 : 1 (by weight)
* Viscosity (A/B): Component A: 2000-2800 cP, Component B: 20-30 cP
(GB/2794-1995)
* Density: 1.42±0.02 g/cm³ (GB/2794-1995)
* Pot Life (25°C): 40-60 minutes
* Cure Time (25°C): 4-6 hours (tack-free), 24 hours (full cure)
* Hardness (Shore A): 30-40 (GB/T531-1999)
* Volume Resistivity: ≥5.0×10¹⁴ Ω·cm (GB/T 31838.2-2019)
* Thermal Conductivity: 0.5±0.1 W/M·K (GB/T 38712-2020)
* Dielectric Strength: ≥14 kV/mm
* Dielectric Constant: ≤3.5
* Elongation at Break: ≤100%
Product Highlights for Silicone Potting Compound:
* Efficient Thermal Management: Excellent thermal conductivity
helps reduce temperatures of power components (e.g., MOSFETs,
IGBTs) by 10-30°C.
* EMI Shielding: Effectively attenuates electromagnetic radiation,
improving product EMC performance.
* Strong Adhesion: Specially optimized for metal substrates like
aluminum, preventing delamination under thermal cycling.
* Comprehensive Environmental Protection: Waterproof,
moisture-proof, dust-proof, and resistant to chemical vapors,
suitable for harsh conditions.
* Excellent Flame Retardancy: The silicone rubber base offers good
flame retardancy, enhancing end-product safety.
Application Areas for Silicone Potting Compound:
* High-power LED drivers, automotive HID ballasts
* New energy vehicle onboard chargers (OBC), motor controllers
* Industrial power supplies, servo drives
* PV inverters, telecom base station power modules
Detailed Operating Guide for Silicone Potting Compound:
1. Surface Preparation: Thoroughly clean heat sink bases (e.g.,
aluminum shells), removing oxide layers and oils to ensure optimal
thermal transfer and adhesion.
2. Accurate Weighing: Use a scale with 0.1g accuracy. Strictly
follow the 10:1 weight ratio.
3. Thorough Mixing: Mix both components thoroughly for at least 3
minutes in a clean container. Pay special attention to scraping the
bottom to incorporate settled fillers for uniformity.
4. Vacuum Degassing: Degas the mixed compound under a vacuum of
-0.095 MPa for 3-5 minutes. This step is crucial for deep fills to
avoid bubble entrapment causing localized overheating.
5. Potting and Curing: Pour the compound slowly into the device.
Gentle vibration can assist in de-airing and leveling. Cure at
25°C. Handling can occur after initial cure; optimal thermal and
mechanical properties are achieved after 7 days.
Key Precautions for Silicone Potting Compound:
* Filler Settling: Fillers in Component A will settle upon storage.
Stir thoroughly before use! Otherwise, it will lead to incorrect
mix ratio and performance loss.
* Do Not Heat Cure: Heating is strictly prohibited as it will cause
violent foaming, destroying the structure.
* Thermally Conductive, Not Electrically Conductive: This is an
electrically insulating thermal material, not for electrical
conduction.
* Device Sealing: Curing produces minimal by-products. Do not
hermetically seal the device enclosure for 3 days (summer) to 7
days (winter).
Packaging & Storage for Silicone Potting Compound:
* Standard Packaging: 22kg/set (20kg A + 2kg B); 11kg/set (10kg A +
1kg B).
* Storage Conditions: Store in a cool, dry place away from direct
sunlight. Ideal storage temperature: 10-30°C.
* Shelf Life: 6 months in original, unopened containers from date
of manufacture.
FAQ for Silicone Potting Compound:
1. Q: How does the thermal performance compare to competitors?
A: A thermal conductivity of 0.5 W/M·K is considered high for
condensation-cure silicones, effectively addressing most high-heat
applications. We can provide real application data for reference.
2. Q: Is it electrically conductive?
A: It is completely non-conductive. Its volume resistivity is on
the order of 10¹⁴ Ω·cm, making it an excellent insulator.
3. Q: How is the adhesion to aluminum substrates? Can it pass
thermal shock tests?
A: This is a core strength. Its elastomeric properties and
optimized adhesion formula effectively absorb CTE mismatch between
aluminum and components, passing -40°C to 125°C for 1000 cycles.
4. Q: Can this be used if my product's heat sink is plastic?
A: Yes, but confirm the plastic housing (e.g., PBT, Nylon) can
withstand the long-term 200°C service temperature. We recommend
compatibility and temperature testing first.
5. Q: Can you customize for higher thermal conductivity?
A: Yes. We have strong R&D capability and can offer customized
formulas with thermal conductivity up to 1.0 W/M·K or higher.
Please contact our engineers to discuss.
