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High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

    Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers
     
    Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers
    • Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers
    • Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers
    • Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers
    • Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers
    • Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers
    • Buy cheap High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration from wholesalers

    High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

    Ask Lasest Price
    Brand Name : Firepower
    Model Number : MGZ318HC-A1
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 500/month
    Delivery Time : 7 days for sample
    • Product Details
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    High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

    High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

    Our MEMS gyroscope chip delivers high-precision angular rate sensing for advanced inertial navigation and motion control applications. Designed with aerospace-level reliability and industrial-grade durability, it provides ultra-low noise, low bias instability, and excellent temperature stability for platforms that require long-term accuracy and robust performance.

    Engineered for UAVs, autonomous robots, and industrial equipment, this MEMS gyro chip offers fast dynamic response, compact form factor, and low power consumption — making it ideal for embedded navigation systems and precision motion platforms.

    PCB Design Guidelines
    • Decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible, with minimized trace equivalent resistance
    • Other ends of decoupling capacitors for VREF, VBUF, and VREG should connect to nearest AVSS_LN and then to signal ground via a magnetic bead
    • Decoupling capacitors for VCC and VIO must be placed close to corresponding pins
    • VCC operation requires about 35mA current — use wide PCB traces to ensure voltage stability
    • Avoid routing under the package for smooth assembly
    • Position components to avoid stress concentration areas, large heat dissipation elements, mechanical contact points, and warping-prone locations
    MEMS Gyroscope Chip technical diagram
    Performance Specifications
    PerformanceUnitMGZ318HC-A1MGZ221HC-A4MGZ330HC-O1
    Rangedeg/s400400400
    Band Width @3DB customizedHz200200300
    Output accuracy(digital SPI)bits242424
    Output rate(ODR)(customized)Hz12K12K12K
    Delay(customized)ms<1.5<1.5<1
    Bias stabilitydeg/hr(1o)<0.1<0.5<0.1
    Bias stability (1σ 10s)deg/hr(1o)<1<5<1
    Bias stability (1σ 1s)deg/hr(1o)<3<15<3
    Bias error over temperature (1σ)deg/hr(1o)<10<3010
    Bias temperature variations, calibrated(1σ)deg/hr(1o)<1<10<1
    Bias repeatabilitydeg/hr(1o)<0.5<3<0.3
    Scale factor at 25°Clsb/deg/s160001600020000
    Scale factor repeatability (1σ)ppm(1o)<20ppm<20ppm<100ppm
    Scale factor vs temperature (1σ)ppm(1o)<100ppm<100ppm<300ppm
    Scale factor non-linearity (1σ)ppm<150ppm<150ppm<300ppm
    Angular random walk(ARW)°/√h<0.05<0.25<0.05
    Noise(Peak to Peak)deg/s<0.35<0.4<0.25
    GValue sensitivity°/hr/g<1<3<1
    Vibration rectification error(12gRMS,20-2000)°/hr/g(rms)<1<3<1
    Power-on time (valid data)s750m
    Sensor Resonant Frequencyhz10.5k-13.5K
    Environmental Specifications
    • Impact (power on): 500g, 1ms
    • Impact resistance (power off): 10000g, 10ms
    • Vibration (power on): 18g rms (20Hz to 2kHz)
    • Working temperature: -40℃ to +85℃
    • Store temperature: -55℃ to +125℃
    • Supply voltage: 5±0.25V
    • Current consumption: 45mA
    MEMS Gyroscope Chip installation diagram
    Installation Guidelines

    This high-performance MEMS gyroscope is precision equipment. For optimal performance, consider these installation recommendations:

    • Evaluate sensor placement using thermal analysis, bending measurement, and finite element simulation
    • Perform drop tests after soldering to verify impact robustness
    • Maintain distance from stress concentration points:
      • Use PCB thickness of 1.6-2.0mm to minimize inherent stress
      • Avoid placement near buttons or mechanical stress points
      • Keep away from heat sources like controllers or graphics chips
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