Fully automated SMT (Surface Mount Technology) production line
equipment
This is a fully automated SMT (Surface Mount Technology) production
line system for the electronics manufacturing sector, encompassing
the complete process from ‘loading → printing → inspection →
sorting → soldering → cooling → optical inspection → board
collection’. Through the coordinated operation of functional
modules, it achieves automated production and quality control for
electronic components such as PCB boards and chip modules.
Core Modules and Functional Analysis
Feeding and Printing Section
1.5KW Board Loader: Automated feeding equipment that batch-feeds
electronic substrates (e.g., PCB boards) into the production line,
replacing manual loading to enhance process efficiency.
2.5KW Screen Printer: Applies solder paste (or markings) onto
substrate surfaces, establishing the foundation for subsequent
component placement and soldering while ensuring printing precision
and uniformity.
100W 0.6 Transfer Station: Connects the printer to downstream
equipment, serving as a buffer and transfer point to maintain
production line continuity.
Inspection and Sorting Section
1.5kW SPI (Solder Paste Inspection Equipment): Utilises optical
technology to inspect post-printing solder paste metrics including
thickness, coverage area, and uniformity, proactively mitigating
soldering defect risks.
1.0 Sorting Machine: Performs preliminary substrate sorting,
removing products with obvious cosmetic or dimensional
non-conformities to reduce wasteful consumption in subsequent
processes.
200W Buffer Station: Temporarily stores substrates awaiting
processing, balancing production rhythms between preceding and
subsequent stages to prevent line congestion or idle time.
100W Transfer Table: Bridges the buffer station and reflow oven,
ensuring smooth substrate transfer into the soldering phase.
Soldering and Cooling Section
80KW Reflow Oven: Employing a thermal cycle of ‘heating → holding →
cooling’ to melt and solidify solder paste, completing the bonding
of electronic components to substrates. This constitutes the core
soldering equipment in the SMT process.
1.0A Cooling Transfer Station: Cools post-soldering substrates to
temperatures compliant with subsequent process requirements,
preventing thermal deformation or performance degradation.
Optical Inspection and Board Collection Section
120W AOI + 1.5KW AOI: Two automatic optical inspection units
conduct defect detection on post-weld substrates, examining
appearance, solder joints, and component placement (e.g., cold
solder joints, missed solder, component misalignment, polarity
errors). Utilising high-precision
imaging and algorithmic recognition, this achieves ‘full
inspection’ level quality control.
200W KDO Board Collector: Automated collection and sorting of
qualified finished products, completing the final stage of the
production line.
Engineering Drawing Information
Dimensions and Layout: The drawing specifies a total length of
18625mm, with clear module dimensions (e.g., 1375mm, 1200mm),
reflecting the production line's compact layout and spatial
planning.
Technical Parameters: Power ratings (e.g., 1.5KW, 80KW) are
specified for each module, indicating energy consumption and power
configuration.
The scale is 1:200, with the part drawing reference ‘Di Ji
20230404’, ensuring complete engineering traceability.
Application Value
Through end-to-end automation and multi-stage high-precision
inspection, this system facilitates the transition from
labour-dependent to intelligent production in electronics
manufacturing:
Efficiency Enhancement: Replaces manual operations, substantially
reducing process time to accommodate mass production demands;
Quality Assurance: Achieves ‘zero-miss’ quality control through
SPI, dual AOI and other inspection stages, reducing defect rates;
Cost Optimisation: Lowers labour costs and scrap losses, enhancing
production economics and competitiveness.
Suitable for large-scale production and quality control of PCB
boards and module products across consumer electronics, automotive
electronics, industrial control and related sectors.
