Product Description
This product is an SMT automated production line that covers the
entire process of PCB board loading, printing, solder paste
inspection, surface mount technology (SMT) placement, soldering,
inspection, and unloading. It integrates core equipment such as a
board loading machine, 1.0 docking station, printing machine, SPI,
SMT placement machine, leveling machine, reflow soldering, AOI, and
unloading machine. Through the intelligent control system, seamless
linkage of each link is achieved, completing the fully automated
operation of PCB boards from raw material loading to finished
product unloading. It meets the requirements of conventional
electronic component mounting and soldering, ensuring the mounting
accuracy and soldering quality while realizing the efficient
operation of the production process.
Product advantages
Full-process automation: From PCB board loading to finished product
unloading, no human intervention is required, covering the entire
process from loading, printing, solder paste inspection, surface
mount technology (SMT) placement, soldering, inspection to
unloading. Production efficiency is increased by more than 50%,
reducing labor costs and quality risks.
Multi-device precise collaboration: The printing machine, SPI,
surface mount technology (SMT) placement machine, reflow soldering
machine, and AOI are efficiently connected through a 1.0 docking
station. The production cycle is stable, and the placement accuracy
is ≤±0.03mm, meeting the precision requirements of conventional SMT
production.
Basic process control: The printing machine adopts closed-loop
control technology. SPI is used for basic solder paste inspection.
Reflow soldering is equipped with a zone-based temperature control
system. AOI is used for full inspection of defects after soldering
to ensure consistency in quality at all stages.
High cost-performance configuration: The equipment configuration
meets the conventional SMT production requirements. Under the
premise of ensuring basic performance, it reduces equipment
investment costs and is suitable for the construction of SMT
production lines in small and medium-sized enterprises.
Product features
The loading machine and the unloading machine achieve automatic
loading and unloading of PCB boards, which is easy to operate.
The printing accuracy of the printing machine is ≤±0.03mm, and it
is suitable for the printing of conventional 0201 and above
components.
SPI detects basic parameters such as solder paste thickness and
area, with a detection accuracy rate of ≥99%.
The surface mount technology (SMT) placement machine supports
multi-nozzle operation and is compatible with conventional SMT
component placement.
The temperature control accuracy of the reflow soldering zone is
±2℃, and the soldering yield is ≥98%.
AOI equipment can identify common defects such as false soldering,
bridging, and missing components, with a detection accuracy rate of
≥99%.
Application scenarios
The conventional PCB board assembly and soldering production in the
electronics manufacturing industry, such as small-batch production
of consumer electronics, basic production of industrial control
boards, and electronic component contract manufacturing, is
particularly suitable for small and medium-sized enterprises with
high requirements for cost control and basic production efficiency.
