JEDEC Standard ESD Safe Matrix Trays For Automated IC Handling
The JEDEC standard matrix tray represents a critical benchmark in
the microelectronics industry, setting the specifications for the
safe handling, transport, and storage of Integrated Circuits (ICs),
modules, and sensitive components. These standardized carriers are
commonly referred to as "matrix" trays due to the precise
arrangement of components nestled into fixed-position pockets,
defined by rows and columns. The defining feature of all JEDEC
standard trays is their globally uniform outline dimensions of 12.7
x 5.35 inches (322.6 x 136mm). This unwavering dimensional
consistency makes them the universal language for automated
equipment operation worldwide.
Features:
JEDEC trays incorporate numerous engineering features optimized for
high-volume automation and component safety. The foremost benefit
is the Industry Standard recognition; instant access to global
equipment and accessories is guaranteed, which significantly
de-risks equipment design, accelerates development time, and lowers
overall cost. Critical design elements facilitate seamless
automation. The tray's center area features flat cells specifically
contoured for automated handling via vacuum pick-up tools, ensuring
reliable component transfer. For mechanical alignment, a distinct
scalloped feature (scalloped feature) is sculpted into one side,
allowing the use of a locating pin to mechanically fix the correct
orientation during use. A crucial visual aid is the 45-degree
chamfer located in one corner, which provides an unambiguous visual
indicator for the Pin 1 orientation of the components within the
matrix.
Technical Parameters:
| Brand | Hiner-pack |
| Model | HN24145 |
| Material | PPE |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 13*13*2.11mm |
| Matrix QTY | 6*16=96PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
Applications:
1. Automated Test and Assembly: Their most intensive use is in
automated test and assembly processes. The components, ranging from
through-hole (PGA, DIP) to surface mount (QFP, BGA) and leadless
devices (LGA, QFN), are presented to pick-and-place machines in a
precise, machine-readable matrix format.
2. Global Transport and Secure Storage: Parts loaded into stacked
JEDEC trays offer an easy, efficient, and highly protective
solution for storage and global logistics. The stacking feature
inherently allows each successive tray to act as a protective cover
for the one beneath it.
3. Process Compatibility: Trays function as carriers for components
through various manufacturing steps, which can include
high-temperature processes like baking (depending on material, such
as mid-temp trays up to 140°C) or cleaning processes.
4. Component Compatibility: Besides traditional ICs (like QFP, BGA,
TSOP, PGA etc.), JEDEC trays are also used for non-traditional
electronic components including connectors, PCBs, MEMS, lenses,
watch parts, and even synthetic stones, leveraging the standardized
automation equipment.
Customization:
A key design genius of the JEDEC standard is that while the
external size and features are rigorously defined, the interior
component pockets were intentionally left undefined and
unrestricted. This freedom is the engine for the tray’s immense
adaptability. And Hiner-pack offer customized materials to meet
specific ESD protection, temperature compatibility, chemical
compatibility, or mechanical strength requirements.
