Product Description:
The Industrial Control PCB is a crucial component in the realm of Industrial Electronic
Components, specifically designed to meet the high demands of
industrial applications. This Print Circuit Board offers a wide
range of customization options to suit various industrial needs.
The testing method employed for the Industrial Control PCB is the
advanced Flying Probe technique. This method allows for
comprehensive testing of the PCB, ensuring that each component and
connection meet the stringent quality standards required for
Industrial PCBA. With Flying Probe testing, potential issues are
identified and rectified early in the production process,
minimizing the risk of defects in the final product.
Applications:
- Manufacturing: machinery control (e.g., CNC machines, injection molding machines)
to enable automated production and improve efficiency.
- Energy:Controls renewable energy systems (e.g., wind turbines, solar
panels), monitoring parameters like wind speed and adjusting
equipment for optimal energy output.
- Transportation:Applies to vehicle electronics (e.g., traction control in trains,
signaling systems) and for safe operation and scheduling.
- Smart Traffic:Manages intelligent traffic lights, analyzing traffic flow data to
dynamically adjust signal timing and reduce congestion.
- Medical Devices:Serves as the core component in equipment like CT scanners,
ensuring stable, low-interference image processing.
- Industrial Automation:Coordinates devices on production lines (e.g., robots, conveyors)
via real-time parameter monitoring and control.
- Smart Homes:Integrates with IoT-based systems (e.g., smart curtains, HVAC
controls) for automated household operations.
- Automotive Electronics:Used in vehicle displays and control units (e.g., door locks,
lighting) for reliable in-vehicle system management.
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The main fabrication process for an Industrial Control Board PCB :
- Layer Alignment Accuracy: Due to the high number of layers, the alignment tolerance between
layers is typically controlled within ±75μm. The large unit size,
environmental factors, and inconsistent expansion/contraction of
different core boards can lead to misalignment issues .
- Internal Circuit Production: The use of special materials like high-TG, high-speed,
high-frequency, and thick copper with thin dielectric layers
increases manufacturing difficulty. Small line widths and spacings
result in more open/short circuits, reduced yield, and higher
chances of AOI inspection misses. Thin inner core boards are prone
to wrinkling and exposure defects .
- Lamination Process: Stacking multiple inner core boards and prepregs can cause defects
like slippage, delamination, resin voids, and residual bubbles.
Material selection must consider heat resistance, voltage
resistance, resin content, and dielectric thickness .
- Drilling Process: Special materials increase drilling roughness, burrs, and
desmearing difficulty. High layer count and total copper thickness
make drills prone to breakage. Dense BGAs and narrow hole wall
spacing can lead to CAF (conductive anodic filament) failures,
while board thickness may cause angled drilling issues .
