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Copper-coated polyimide film applied in flexible circuit scenarios

    Buy cheap Copper-coated polyimide film applied in flexible circuit scenarios from wholesalers
     
    Buy cheap Copper-coated polyimide film applied in flexible circuit scenarios from wholesalers
    • Buy cheap Copper-coated polyimide film applied in flexible circuit scenarios from wholesalers
    • Buy cheap Copper-coated polyimide film applied in flexible circuit scenarios from wholesalers

    Copper-coated polyimide film applied in flexible circuit scenarios

    Ask Lasest Price
    Brand Name : Guofeng
    Model Number : 25um
    Certification : SGS Reach ROHS
    Price : $300-$30000
    Payment Terms : L/C,T/T
    Supply Ability : Negotiation
    Delivery Time : 7 Working Days
    • Product Details
    • Company Profile

    Copper-coated polyimide film applied in flexible circuit scenarios

    Copper-coated polyimide film applied in flexible circuit scenarios
    Product Overview:

    The GL series represents a breakthrough in polyimide film performance. Its exclusive manufacturing process forms a distinctively oriented molecular structure, enhancing critical properties—including tensile strength, dimensional stability, and chemical resistance—by a steady 30%. This adaptable, inherently yellow film offers customizable thickness options and serves as the perfect solution for high-demand applications such as adhesive substrates and advanced chip packaging.

    Place of Origin:
    ANHUI, CHINA
    Material:
    Polyimide
    Color:
    Yellow
    Treatment:
    Single-side / Both Sides
    Width:
    514MM, 520MM, 1028MM, 1040MM
    Thickness:
    custom
    Packaging:
    vacuum packaging
    Supply Ability:
    2000 ton/year
    Product Features:

    Robust Mechanical Durabilit

    Exceptional Dimensional Integrity

    Excellent Lamination Performance
    Compliant with RoHS and REACH


    Product Applications:
    1. Acts as a base material for high-precision adhesive Flexible Copper Clad Laminates (FCCL)
    2. Serves as a cover layer with exceptional dimensional stability
    3. Utilized in the packaging of semiconductor chips
    4. Functions as a base film for specialized adhesive tapes



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