1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

The TIF^®100-10E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive: 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Outstanding thermal performance
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.