Dual-track parallel SMT (Surface Mount Technology) automated
production line equipment
Equipment Composition and Functionality
Loading and Printing Stage
U-shaped Loading Machine, L-shaped Unloading Machine: Responsible
for PCB loading and unloading respectively, enabling automated
board conveyance.
Printing Machine: Precisely deposits solder paste onto PCB pads,
laying the foundation for subsequent placement operations.
1.0 Transfer Station: Complements the printer and pick-and-place
machines, ensuring precise handover and transfer of PCBs between
equipment.
Placement Process
Multiple Pick-and-Place Machines: Utilise high-precision vision
systems to pick resistors, capacitors, chips and other components,
placing them accurately onto PCB pads. Multiple machines operate in
parallel, simultaneously handling placement requirements for
different types (small components, irregularly shaped components),
significantly boosting production efficiency.
Soldering and Post-Processing Stage
4.5-metre Transfer Machine, 0.64-metre Dual-Track Transfer Basket
Station: Facilitates PCB transfer and handover between dual-track
production lines, ensuring synchronisation of the dual-track
process.
Dual-Track Reflow Oven: Utilises multi-zone heating (preheating,
reflow, cooling) to melt and solidify solder paste, completing
component-to-PCB bonding; The ‘dual-track’ configuration enables
simultaneous processing of PCBs from two production lines, doubling
throughput capacity.
Compact Dual-Track Board Collector: Automates the collection of
finished PCBs, completing material retrieval at the production
line's end.
Production Line Features
Dual-Track Parallel Operation for High-Volume Efficiency: The
dual-track design enables synchronous operation of two production
lines,
substantially increasing output per unit time. This configuration
is ideally suited for large-scale mass production scenarios such as
consumer electronics (e.g., batch production of mobile phone
motherboards).
Fully Automated Process: From PCB loading, solder paste printing,
component placement to reflow soldering and board collection, all
stages operate without manual intervention, ensuring production
efficiency and product consistency.
High Precision Assurance: The placement machine achieves
micron-level positioning accuracy, accommodating 01005 ultra-micro
component placement; dual-track reflow ovens deliver precise
temperature zone control, guaranteeing soldering quality.
This production line represents exemplary equipment for achieving
scaled, intelligent manufacturing within the electronics industry.
Suitable for SMT production of consumer electronics such as mobile
phones, tablets, and smart hardware, its dual-track parallel design
maximises production efficiency while ensuring product quality
stability through fully automated processes.
