Full-process SMT (Surface Mount Technology) automated production
line equipment
Equipment Composition and Functionality
Loading and Pre-processing Stage
PCB Loading and Unboxing Machine: Automates the unboxing and
feeding of printed circuit boards (PCBs), supplying initial
materials to the production line and initiating the manufacturing
process.
AOI Pre-inspection Machine: Performs optical inspection of PCBs
prior to placement, identifying defects such as board flaws and pad
anomalies. This pre-emptively removes non-conforming items,
safeguarding subsequent process quality.
0.6 Waste Paper Collection Station: Gathers waste paper or scrap
tape generated during pre-processing to maintain production line
tidiness.
Placement and Soldering Process
Multiple Placement Machines: Utilise high-precision vision systems
to pick resistors, capacitors, chips and other components, placing
them accurately onto PCB pads. Coordinated operation of multiple
placement machines enables simultaneous handling of diverse
placement tasks (small components, irregularly shaped components),
enhancing production efficiency.
2.0 Placement Conveyor: Ensures stable PCB transfer between
multiple placement machines, enabling continuous placement
operations.
Dual-Track Reflow Oven: Utilises multi-zone heating (preheating,
reflow, cooling) to melt and solidify solder paste, achieving
permanent component-to-PCB bonding; the ‘dual-track’ design
processes PCBs from two production lines simultaneously,
significantly boosting output.
Inspection and Unloading Section
Post-AOI Inspection Machine: Performs optical inspection on PCBs
post-soldering to identify defects such as cold solder joints,
bridging, and component misalignment, ensuring stringent quality
control.
1.2 Paper Feeder, Lift, and Conveyor Belt: Coordinates with
inspection equipment to unload, sort (good/defective), and
transport PCBs, enabling automated end-of-line collection.
Return Line: Facilitates reflow processing for defective or
rework-required PCBs, enhancing material utilisation.
Production Line Features
End-to-End Automation: Fully automated operation from PCB loading,
pre-inspection, placement, soldering to post-inspection and
unloading. This substantially boosts production efficiency and
product consistency while reducing labour costs.
High Precision and High Throughput: Placement machines feature
micron-level positioning accuracy, accommodating 01005 ultra-micro
component placement. Dual-track reflow ovens coordinate with
multiple placement machines, adapting to large-scale production
scenarios (e.g., batch manufacturing of mobile phone and tablet
motherboards).
End-to-End Quality Control: A dual AOI inspection mechanism
combining pre-inspection and post-inspection ensures product
quality is monitored at both the source and final stages,
minimising the risk of defective products entering circulation. The
return line design facilitates rework processing for faulty items,
enhancing production flexibility.
This production line is suitable for large-scale SMT manufacturing
in consumer electronics, automotive electronics and other sectors.
It efficiently completes the entire automated placement and
soldering process for PCBs, serving as core equipment for achieving
intelligent, large-scale production in the electronics
manufacturing industry.
