SMT (Surface Mount Technology) Inspection and Post-Soldering
Processing Equipment Combination
Equipment Composition and Functionality
AOI Inspection Stage
AOI Equipment:
An Automated Optical Inspection machine utilises high-definition
cameras and optical systems to conduct comprehensive inspection of
post-soldering PCB boards. It identifies defects such as cold
solder joints, bridging, missing components, and component
misalignment, thereby ensuring product soldering quality.
0.59 Transfer Basket Station: Transfers PCBs from conveyor tracks
to the AOI inspection station, enabling automated loading and
unloading.
2.8 Translator: Facilitates horizontal movement of PCBs during
inspection, ensuring process continuity.
800×800 Workbench: Provides an installation and operating platform
for AOI equipment or peripheral auxiliary devices, optimising
equipment layout.
Post-Soldering Processing Stage
Dual-Track Reflow Oven: Achieves solder paste melting and
solidification through multi-zone heating (preheating, reflow,
cooling), establishing permanent component-to-PCB connections. The
‘dual-track’ design processes PCBs from two production lines
simultaneously, substantially boosting efficiency.
Complementary Conveying and Control Equipment: Ensures stable PCB
transport within the reflow oven while enabling precise control of
process parameters such as temperature and timing.
Production Line Features
High Inspection Accuracy:
AOI equipment employs high-precision optical recognition technology
to detect micron-level soldering defects, meeting stringent
soldering quality requirements in consumer electronics, automotive
electronics, and similar sectors.
Seamless Process Integration:
Automated transfer between reflow soldering and AOI inspection is
achieved via transfer and translation mechanisms, reducing manual
intervention while enhancing production efficiency and inspection
consistency.
Modular Design:
Each unit operates independently yet combines flexibly. The number
of AOI systems and reflow oven specifications can be adjusted
according to production line scale and inspection requirements,
adapting to diverse manufacturing capacities.
This integrated system serves the back-end processes of SMT
production lines, providing reliable assurance for electronic PCB
board soldering quality. It finds extensive application in the mass
production of electronic products including mobile phones,
computers, and industrial control boards.
