Double-sided Black Oil OSP Process PCB
A double-sided black solder mask OSP-processed PCB is a type of printed circuit board featuring conductive tracks on
both sides, protected by a black solder mask layer, and treated
with Organic Solderability Preservative (OSP) for surface
finishing. The black solder mask serves to insulate circuitry,
prevent solder bridging, and enhance aesthetics, while OSP involves
applying a thin, organic coating to copper pads to prevent
oxidation and improve solderability during assembly. This
combination is cost-effective, environmentally friendly, and
commonly used in consumer electronics like smartphones and
computers due to its suitability for lead-free soldering processes.
Application Adaptability
1.welding reliability (such as automated SMT patch)
2.appearance consistency (such as black whole machine design)
3.insulation protection (such as double-sided dense circuits)
smartphone motherboards,
automotive central control modules,
small industrial sensors, etc.
Characteristics of Double-Sided Black Oil OSP Process Products
Appearance Characteristics
1.Double-sided black solder mask layer:
The surface presents a uniform matte or bright black color, with a
unified visual effect and high recognition, suitable for equipment
requiring high appearance texture (such as high-end electronic
instruments, smart home products).
Strong circuit concealment: The black solder mask ink can effectively cover the underlying
circuit layout, with a certain degree of peep resistance, and at
the same time reduce the interference of light reflection on the
internal optical components of the equipment (such as camera
modules, circuit boards around sensors).
2.Performance Characteristics
Excellent solderability: The OSP protective layer adheres to the copper surface through
chemical adsorption, which can isolate the contact between air and
copper, prevent copper foil oxidation, and ensure good welding
activity after long-term storage, especially suitable for lead-free
welding processes.
Reliable insulation and protection: The black oil solder mask layer has a uniform thickness (usually
20-50μm) and high insulation resistance, which can effectively
isolate adjacent circuits and prevent short circuits; at the same
time, it has a certain degree of temperature resistance (usually
can withstand short-term high temperatures of 130-180℃), moisture
resistance and chemical corrosion resistance, protecting the
circuit from environmental damage.
3.Process and Cost Characteristics
Strong process compatibility: The OSP process is a lead-free and heavy metal-free environmental
protection treatment method, in line with RoHS and other
environmental protection standards; the black oil solder mask layer
has good bonding with the OSP layer, and will not affect product
stability due to process conflicts.
Controllable cost: Compared with surface treatments such as gold plating and
immersion gold, the OSP process has lower cost, and the black oil
solder mask ink is a conventional material. The overall production
process is simple, suitable for mass production, and can balance
performance and cost.
Limitations: The OSP layer has weak wear resistance and should avoid frequent
friction; long-term exposure to high temperature and high humidity
environments may affect the protection effect, so it is more
suitable for indoor applications or applications with sealed
enclosures.
